Block diagram
Highlighted components are Nexperia focus products
Products - Motor drive
Products - AC/DC (PFC) / DC/DC
Products - HMI / MMI
Products - General
Design considerations
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Nexperia’s clip-bond package options enable high-efficiency on motor control (better duty precision) and higher frequency DC:DC conversion
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Best thermal performance thanks to clip-bond package and lower switch losses. Allows use of air cooled heat spreader rather than more expensive and complex water cooled systems
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Best in class SOA and avalanche capabilities increase robustness and reliability of the system (Higher ID current allowed in PWM mode)
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As a worldwide leading producer of ESD components, HMI and Display protection secured from any ESD damage
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Battery booster enables extension of cell battery lifetime by up to 3 times
High current 3-phase BLDC motor drive application
Power engineers are often presented with new, smaller package options. Here we look at Nexperia’s LFPAK 8 x 8 MOSFETs demonstrating their ability of both the high current performance and the thermal characteristics.
H-bridge motor controller design using Nexperia discrete semiconductors and logic ICs
The H-bridge circuit is a full bridge DC-to-DC converter allowing operation of a brushed DC motor (48 V max, 12 V min, 5 A max). The key feature of this design is that all electronic functions are designed with Nexperia discrete and logic IC components (low cost, no micro-controller or software needed).
MOSFET and GaN FET Handbook
Drawing on over 20 years’ of experience, the MOSFET and GaN FET Application Handbook: A Power Design Engineer’s Guide brings together a comprehensive set of learning and reference materials relating to the use of MOSFETs and GaN FETs in real world systems.