Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74AHCT164BQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AHCT164BQ-Q100SOT762-1DHVQFN1418.26535 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9353013791155126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000231.000000.00127
FillerSilver (Ag)7440-22-40.0174475.000000.09551
PolymerAcrylic resinProprietary0.001406.000000.00764
Resin systemProprietary0.0041918.000000.02292
subTotal0.02326100.000000.12734
DieDoped siliconSilicon (Si)7440-21-30.29232100.000001.60042
subTotal0.29232100.000001.60042
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.7447197.4700036.92625
Iron (Fe)7439-89-60.166072.400000.90923
Phosphorus (P)7723-14-00.002080.030000.01137
Zinc (Zn)7440-66-60.006920.100000.03788
subTotal6.91978100.0000037.88473
Mould CompoundAdditiveNon hazardousProprietary0.313922.984001.71865
FillerSilica -amorphous-7631-86-90.367153.490002.01008
Silica fused60676-86-08.9230784.8200048.85246
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.105411.002000.57711
PigmentCarbon black1333-86-40.017250.164000.09446
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.389353.701002.13161
Epoxy resin systemProprietary0.166851.586000.91346
Phenolic resinProprietary0.237022.253001.29763
subTotal10.52001100.0000057.59546
Pre-PlatingPure metal layerGold (Au)7440-57-50.013843.000000.07578
Nickel (Ni)7440-02-00.4258792.300002.33159
Palladium (Pd)7440-05-30.014303.100000.07831
Silver (Ag)7440-22-40.007381.600000.04042
subTotal0.46140100.000002.52610
WirePure metalCopper (Cu)7440-50-80.0469096.550000.25676
Pure metal layerGold (Au)7440-57-50.000170.350000.00093
Palladium (Pd)7440-05-30.001513.100000.00824
subTotal0.04857100.000000.26593
total18.26535100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.