Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74AHCT595BQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AHCT595BQ-Q100SOT763-1DHVQFN1621.744624 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352986341155126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.0009971.0000000.004584
FillerSilver (Ag)7440-22-40.07476075.0000000.343809
PolymerAcrylic resinProprietary0.0059816.0000000.027505
Resin systemProprietary0.01794218.0000000.082514
subTotal0.099680100.0000000.458412
DieDoped siliconSilicon (Si)7440-21-30.421846100.0000001.940004
subTotal0.421846100.0000001.940004
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-87.97467497.47000036.674232
Iron (Fe)7439-89-60.1963602.4000000.903028
Phosphorus (P)7723-14-00.0024550.0300000.011288
Zinc (Zn)7440-66-60.0081820.1000000.037626
subTotal8.181670100.00000037.626174
Mould CompoundAdditiveNon hazardousProprietary0.3711642.9840001.706923
FillerSilica -amorphous-7631-86-90.4341033.4900001.996367
Silica fused60676-86-010.55031084.82000048.519166
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1246331.0020000.573169
PigmentCarbon black1333-86-40.0203990.1640000.093812
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.4603483.7010002.117065
Epoxy resin systemProprietary0.1972741.5860000.907232
Phenolic resinProprietary0.2802392.2530001.288772
subTotal12.438470100.00000057.202507
Pre-PlatingPure metal layerGold (Au)7440-57-50.0163653.0000000.075261
Nickel (Ni)7440-02-00.50350692.3000002.315541
Palladium (Pd)7440-05-30.0169113.1000000.077770
Silver (Ag)7440-22-40.0087281.6000000.040139
subTotal0.545510100.0000002.508712
WirePure metalCopper (Cu)7440-50-80.05546696.5500000.255078
Pure metal layerGold (Au)7440-57-50.0002010.3500000.000925
Palladium (Pd)7440-05-30.0017813.1000000.008190
subTotal0.057448100.0000000.264192
total21.744624100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.