Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74AUP1G02GZ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AUP1G02GZSOT8065-1XSON51.243037 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9356917473153126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.044184100.0000003.554503
subTotal0.044184100.0000003.554503
ComponentAdditiveNon hazardousProprietary0.0011005.0000000.088493
FillerBisphenol A-epichlorohydrin resin25068-38-60.0011005.0000000.088493
Silica -amorphous-7631-86-90.01100050.0000000.884929
PolymerEpoxy resin systemProprietary0.00660030.0000000.530958
Phenol Formaldehyde resin (generic)9003-35-40.00220010.0000000.176986
subTotal0.022000100.0000001.769859
Lead FrameCopper alloyCopper (Cu)7440-50-80.44223494.90000035.576898
Magnesium (Mg)7439-95-40.0006990.1500000.056233
Nickel (Ni)7440-02-00.0137942.9600001.109669
Silicon (Si)7440-21-30.0029820.6400000.239928
Pure metal layerGold (Au)7440-57-50.0000930.0200000.007498
Nickel (Ni)7440-02-00.0059651.2800000.479857
Palladium (Pd)7440-05-30.0002330.0500000.018744
subTotal0.466000100.00000037.488828
Mould CompoundAdditiveNon hazardousProprietary0.0027760.4100000.223300
FillerSilica -amorphous-7631-86-90.0019630.2900000.157944
Silica fused60676-86-00.58323686.15000046.920204
HardenerPhenolic resinProprietary0.0290434.2900002.336479
PigmentCarbon black1333-86-40.0012860.1900000.103480
PolymerEpoxy resin systemProprietary0.0586968.6700004.721975
subTotal0.677000100.00000054.463383
Post-PlatingImpurityNon hazardousProprietary0.0000020.0100000.000177
Tin alloyTin (Sn)7440-31-50.02199899.9900001.769682
subTotal0.022000100.0000001.769859
WireImpurityNon hazardousProprietary0.0000010.0100000.000095
Pure metalCopper (Cu)7440-50-80.01143896.4900000.920136
Pure metal layerGold (Au)7440-57-50.0000590.5000000.004768
Palladium (Pd)7440-05-30.0003563.0000000.028608
subTotal0.011854100.0000000.953608
total1.243037100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.