Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74HC32BQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74HC32BQ-Q100SOT762-1DHVQFN1418.16296 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352989221156126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000231.000000.00128
FillerSilver (Ag)7440-22-40.0174475.000000.09605
PolymerAcrylic resinProprietary0.001406.000000.00768
Resin systemProprietary0.0041918.000000.02305
subTotal0.02326100.000000.12806
DieDoped siliconSilicon (Si)7440-21-30.18485100.000001.01773
subTotal0.18485100.000001.01773
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.7447197.4700037.13442
Iron (Fe)7439-89-60.166072.400000.91436
Phosphorus (P)7723-14-00.002080.030000.01143
Zinc (Zn)7440-66-60.006920.100000.03810
subTotal6.91978100.0000038.09831
Mould CompoundAdditiveNon hazardousProprietary0.313922.984001.72834
FillerSilica -amorphous-7631-86-90.367153.490002.02141
Silica fused60676-86-08.9230784.8200049.12785
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.105411.002000.58036
PigmentCarbon black1333-86-40.017250.164000.09499
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.389353.701002.14362
Epoxy resin systemProprietary0.166851.586000.91861
Phenolic resinProprietary0.237022.253001.30494
subTotal10.52001100.0000057.92012
Pre-PlatingPure metal layerGold (Au)7440-57-50.013843.000000.07621
Nickel (Ni)7440-02-00.4258792.300002.34473
Palladium (Pd)7440-05-30.014303.100000.07875
Silver (Ag)7440-22-40.007381.600000.04065
subTotal0.46140100.000002.54034
WirePure metalCopper (Cu)7440-50-80.0518196.550000.28524
Pure metal layerGold (Au)7440-57-50.000190.350000.00103
Palladium (Pd)7440-05-30.001663.100000.00916
subTotal0.05366100.000000.29543
total18.16296100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.