Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74LVC1G66GZ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LVC1G66GZSOT8065-1XSON51.27088 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9356915193153126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.07360100.000005.79163
subTotal0.07360100.000005.79163
ComponentAdditiveNon hazardousProprietary0.001105.000000.08655
FillerBisphenol A-epichlorohydrin resin25068-38-60.001105.000000.08655
Silica -amorphous-7631-86-90.0110050.000000.86554
PolymerEpoxy resin systemProprietary0.0066030.000000.51933
Phenol Formaldehyde resin (generic)9003-35-40.0022010.000000.17311
subTotal0.02200100.000001.73108
Lead FrameCopper alloyCopper (Cu)7440-50-80.4443995.5684434.96736
Magnesium (Mg)7439-95-40.000710.152090.05565
Nickel (Ni)7440-02-00.013872.983291.09155
Silicon (Si)7440-21-30.003020.648800.23739
Pure metal layerGold (Au)7440-57-50.000050.010820.00396
Nickel (Ni)7440-02-00.002780.596940.21841
Palladium (Pd)7440-05-30.000180.039620.01450
subTotal0.46500100.0000036.58882
Mould CompoundAdditiveNon hazardousProprietary0.002780.410000.21841
FillerSilica -amorphous-7631-86-90.001960.290000.15448
Silica fused60676-86-00.5832486.1500045.89226
HardenerPhenolic resinProprietary0.029044.290002.28529
PigmentCarbon black1333-86-40.001290.190000.10121
PolymerEpoxy resin systemProprietary0.058708.670004.61852
subTotal0.67700100.0000053.27017
Post-PlatingImpurityNon hazardousProprietary0.000000.010000.00017
Tin alloyTin (Sn)7440-31-50.0220099.990001.73091
subTotal0.02200100.000001.73108
WireImpurityNon hazardousProprietary0.000000.010000.00009
Pure metalCopper (Cu)7440-50-80.0108896.490000.85601
Pure metal layerGold (Au)7440-57-50.000060.500000.00444
Palladium (Pd)7440-05-30.000343.000000.02661
subTotal0.01127100.000000.88715
total1.27088100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.