Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BC53-10PAST-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BC53-10PAST-QSOT1061DHUSON37.429640 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346679341152126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.08800080.0000001.184445
PolymerAcrylic resinProprietary0.02200020.0000000.296111
subTotal0.110000100.0000001.480556
DieDoped siliconSilicon (Si)7440-21-30.078000100.0000001.049849
subTotal0.078000100.0000001.049849
Lead FrameCopper alloyCopper (Cu)7440-50-82.63127493.84000035.415896
Magnesium (Mg)7439-95-40.0140200.5000000.188704
Nickel (Ni)7440-02-00.1037483.7000001.396407
Silicon (Si)7440-21-30.0224320.8000000.301926
Pure metal layerGold (Au)7440-57-50.0016820.0600000.022644
Nickel (Ni)7440-02-00.0280401.0000000.377407
Palladium (Pd)7440-05-30.0028040.1000000.037741
subTotal2.804000100.00000037.740725
Mould CompoundAdditiveNon hazardousProprietary0.0174660.4100000.235085
FillerSilica -amorphous-7631-86-90.0123540.2900000.166280
Silica fused60676-86-03.66999086.15000049.396606
HardenerPhenolic resinProprietary0.1827544.2900002.459796
PigmentCarbon black1333-86-40.0080940.1900000.108942
PolymerEpoxy resin systemProprietary0.3693428.6700004.971196
subTotal4.260000100.00000057.337906
Post-PlatingImpurityLead (Pb)7439-92-10.0000080.0045000.000103
Non hazardousProprietary0.0000940.0555000.001270
Tin solderTin (Sn)7440-31-50.16989899.9400002.286760
subTotal0.170000100.0000002.288132
WireImpurityNon hazardousProprietary0.0000010.0100000.000010
Pure metalCopper (Cu)7440-50-80.00763999.9900000.102821
subTotal0.007640100.0000000.102831
total7.429640100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.