Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BZX8850-B10

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BZX8850-B10SOD882DFN1006-20.944300 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346671363152126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00760076.0000000.804829
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00104710.4700000.110876
Phenolic resinProprietary0.00135313.5300000.143281
subTotal0.010000100.0000001.058985
DieDoped siliconSilicon (Si)7440-21-30.050000100.0000005.294927
subTotal0.050000100.0000005.294927
Lead FrameCopper alloyCopper (Cu)7440-50-80.38740994.49000041.026051
Magnesium (Mg)7439-95-40.0008200.2000000.086837
Nickel (Ni)7440-02-00.0129153.1500001.367680
Silicon (Si)7440-21-30.0028290.6900000.299587
Pure metal layerGold (Au)7440-57-50.0001230.0300000.013026
Nickel (Ni)7440-02-00.0052071.2700000.551414
Palladium (Pd)7440-05-30.0006970.1700000.073811
subTotal0.410000100.00000043.418405
Mould CompoundFillerSilica -amorphous-7631-86-90.10350023.00000010.960500
Silica fused60676-86-00.27000060.00000028.592608
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0135003.0000001.429630
Ion trapping agentBismuth (Bi)7440-69-90.0022500.5000000.238272
PigmentCarbon black1333-86-40.0022500.5000000.238272
PolymerEpoxy resin systemProprietary0.0315007.0000003.335804
Phenolic resinProprietary0.0270006.0000002.859261
subTotal0.450000100.00000047.654347
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000095
Non hazardousProprietary0.0000110.0555000.001175
Tin solderTin (Sn)7440-31-50.01998899.9400002.116700
subTotal0.020000100.0000002.117971
WireImpurityNon hazardousProprietary0.0000000.0100000.000046
Pure metalGold (Au)7440-57-50.00432099.9900000.457436
subTotal0.004320100.0000000.457482
total0.944300100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.