Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BZX8850-C20

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BZX8850-C20SOD882DFN1006-20.924300 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346671073152126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00760076.0000000.822244
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00104710.4700000.113275
Phenolic resinProprietary0.00135313.5300000.146381
subTotal0.010000100.0000001.081900
DieDoped siliconSilicon (Si)7440-21-30.030000100.0000003.245699
subTotal0.030000100.0000003.245699
Lead FrameCopper alloyCopper (Cu)7440-50-80.38740994.49000041.913773
Magnesium (Mg)7439-95-40.0008200.2000000.088716
Nickel (Ni)7440-02-00.0129153.1500001.397274
Silicon (Si)7440-21-30.0028290.6900000.306069
Pure metal layerGold (Au)7440-57-50.0001230.0300000.013307
Nickel (Ni)7440-02-00.0052071.2700000.563345
Palladium (Pd)7440-05-30.0006970.1700000.075408
subTotal0.410000100.00000044.357892
Mould CompoundFillerSilica -amorphous-7631-86-90.10350023.00000011.197663
Silica fused60676-86-00.27000060.00000029.211295
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0135003.0000001.460565
Ion trapping agentBismuth (Bi)7440-69-90.0022500.5000000.243427
PigmentCarbon black1333-86-40.0022500.5000000.243427
PolymerEpoxy resin systemProprietary0.0315007.0000003.407984
Phenolic resinProprietary0.0270006.0000002.921130
subTotal0.450000100.00000048.685492
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000097
Non hazardousProprietary0.0000110.0555000.001201
Tin solderTin (Sn)7440-31-50.01998899.9400002.162501
subTotal0.020000100.0000002.163800
WireImpurityNon hazardousProprietary0.0000000.0100000.000047
Pure metalGold (Au)7440-57-50.00432099.9900000.467334
subTotal0.004320100.0000000.467381
total0.924300100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.