Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content CBT3245ABQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
CBT3245ABQ-Q100SOT764-1DHVQFN2028.122231 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93530047211516126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.0008531.0000000.003032
FillerSilver (Ag)7440-22-40.06396075.0000000.227436
PolymerAcrylic resinProprietary0.0051176.0000000.018195
Resin systemProprietary0.01535018.0000000.054585
subTotal0.085280100.0000000.303248
DieDoped siliconSilicon (Si)7440-21-30.337617100.0000001.200534
subTotal0.337617100.0000001.200534
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.58895697.47000037.653327
Iron (Fe)7439-89-60.2607312.4000000.927136
Phosphorus (P)7723-14-00.0032590.0300000.011589
Zinc (Zn)7440-66-60.0108640.1000000.038631
subTotal10.863810100.00000038.630683
Mould CompoundAdditiveNon hazardousProprietary0.4886282.9840001.737514
FillerSilica -amorphous-7631-86-90.5714853.4900002.032146
Silica fused60676-86-013.88920784.82000049.388710
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1640771.0020000.583441
PigmentCarbon black1333-86-40.0268550.1640000.095493
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.6060363.7010002.155006
Epoxy resin systemProprietary0.2597061.5860000.923491
Phenolic resinProprietary0.3689272.2530001.311869
subTotal16.374920100.00000058.227670
Pre-PlatingPure metal layerGold (Au)7440-57-50.0027581.0000000.009806
Nickel (Ni)7440-02-00.25096091.0000000.892389
Palladium (Pd)7440-05-30.0220628.0000000.078452
subTotal0.275780100.0000000.980648
WirePure metalGold (Au)7440-57-50.18297699.0000000.650645
Palladium (Pd)7440-05-30.0018481.0000000.006572
subTotal0.184824100.0000000.657217
total28.122231100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.