Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content CBT3245ABQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
CBT3245ABQ-Q100SOT764-1DHVQFN2028.12223 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93530047211516126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000851.000000.00303
FillerSilver (Ag)7440-22-40.0639675.000000.22744
PolymerAcrylic resinProprietary0.005126.000000.01819
Resin systemProprietary0.0153518.000000.05458
subTotal0.08528100.000000.30324
DieDoped siliconSilicon (Si)7440-21-30.33762100.000001.20053
subTotal0.33762100.000001.20053
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.5889697.4700037.65333
Iron (Fe)7439-89-60.260732.400000.92714
Phosphorus (P)7723-14-00.003260.030000.01159
Zinc (Zn)7440-66-60.010860.100000.03863
subTotal10.86381100.0000038.63069
Mould CompoundAdditiveNon hazardousProprietary0.488632.984001.73751
FillerSilica -amorphous-7631-86-90.571483.490002.03215
Silica fused60676-86-013.8892184.8200049.38871
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.164081.002000.58344
PigmentCarbon black1333-86-40.026850.164000.09549
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.606043.701002.15501
Epoxy resin systemProprietary0.259711.586000.92349
Phenolic resinProprietary0.368932.253001.31187
subTotal16.37492100.0000058.22767
Pre-PlatingPure metal layerGold (Au)7440-57-50.002761.000000.00981
Nickel (Ni)7440-02-00.2509691.000000.89239
Palladium (Pd)7440-05-30.022068.000000.07845
subTotal0.27578100.000000.98065
WirePure metalGold (Au)7440-57-50.1829899.000000.65064
Palladium (Pd)7440-05-30.001851.000000.00657
subTotal0.18482100.000000.65721
total28.12223100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.