Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content NMUX1237GW

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
NMUX1237GWSOT363-2SC-885.83461 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9356917111253126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.19390100.000003.32332
subTotal0.19390100.000003.32332
ComponentAdditiveNon hazardousProprietary0.000255.000000.00428
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.00428
Silica -amorphous-7631-86-90.0025050.000000.04285
PolymerEpoxy resin systemProprietary0.0015030.000000.02571
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.00857
subTotal0.00500100.000000.08569
Lead FrameCopper alloyCopper (Cu)7440-50-82.0433296.8400035.02075
Iron (Fe)7439-89-60.048742.310000.83538
Lead (Pb)7439-92-10.000210.010000.00362
Phosphorus (P)7723-14-00.001480.070000.02531
Zinc (Zn)7440-66-60.002530.120000.04340
Pure metal layerSilver (Ag)7440-22-40.013720.650000.23506
subTotal2.11000100.0000036.16352
Mould CompoundFillerSilica -amorphous-7631-86-90.4396014.000007.53435
Silica fused60676-86-02.2159070.5700037.97851
PigmentCarbon black1333-86-40.006280.200000.10763
PolymerEpoxy resin systemProprietary0.291719.290004.99958
Phenolic resinProprietary0.186525.940003.19672
subTotal3.14000100.0000053.81679
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00019
Bismuth (Bi)7440-69-90.000000.001000.00006
Copper (Cu)7440-50-80.000000.001000.00006
Lead (Pb)7439-92-10.000020.005000.00032
Tin solderTin (Sn)7440-31-50.3699699.990006.34084
subTotal0.37000100.000006.34147
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0157099.990000.26916
subTotal0.01571100.000000.26919
total5.83461100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.