Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content NXB0104BQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
NXB0104BQ-Q100SOT762-1DHVQFN1418.24627 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9356908811156126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000231.000000.00127
FillerSilver (Ag)7440-22-40.0174475.000000.09561
PolymerAcrylic resinProprietary0.001406.000000.00765
Resin systemProprietary0.0041918.000000.02295
subTotal0.02326100.000000.12748
DieDoped siliconSilicon (Si)7440-21-30.50476100.000002.76636
subTotal0.50476100.000002.76636
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.8028397.4700037.28341
Iron (Fe)7439-89-60.167512.400000.91803
Phosphorus (P)7723-14-00.002090.030000.01148
Zinc (Zn)7440-66-60.006980.100000.03825
subTotal6.97941100.0000038.25117
Mould CompoundAdditiveNon hazardousProprietary0.313922.984001.72045
FillerSilica -amorphous-7631-86-90.367153.490002.01218
Silica fused60676-86-08.9230784.8200048.90354
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.105411.002000.57771
PigmentCarbon black1333-86-40.017250.164000.09456
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.389353.701002.13384
Epoxy resin systemProprietary0.166851.586000.91442
Phenolic resinProprietary0.237022.253001.29898
subTotal10.52001100.0000057.65568
Pre-PlatingPure metal layerGold (Au)7440-57-50.001771.000000.00971
Nickel (Ni)7440-02-00.1612391.000000.88365
Palladium (Pd)7440-05-30.014178.000000.07768
subTotal0.17718100.000000.97104
WirePure metalCopper (Cu)7440-50-80.0402296.550000.22042
Pure metal layerGold (Au)7440-57-50.000150.350000.00080
Palladium (Pd)7440-05-30.001293.100000.00708
subTotal0.04166100.000000.22830
total18.24627100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.