Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PBSS5112PAP

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PBSS5112PAPSOT1118HUSON67.265448 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340668941157126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.06240080.0000000.858860
PolymerAcrylic resinProprietary0.01560020.0000000.214715
subTotal0.078000100.0000001.073575
DieDoped siliconSilicon (Si)7440-21-30.420000100.0000005.780786
subTotal0.420000100.0000005.780786
Lead FrameCopper alloyCopper (Cu)7440-50-82.55941095.11000035.227148
Magnesium (Mg)7439-95-40.0053820.2000000.074077
Nickel (Ni)7440-02-00.0853053.1700001.174115
Silicon (Si)7440-21-30.0185680.6900000.255564
Pure metal layerGold (Au)7440-57-50.0005380.0200000.007408
Nickel (Ni)7440-02-00.0199130.7400000.274084
Palladium (Pd)7440-05-30.0018840.0700000.025927
subTotal2.691000100.00000037.038322
Mould CompoundAdditiveNon hazardousProprietary0.0159410.4100000.219406
FillerSilica -amorphous-7631-86-90.0112750.2900000.155189
Silica fused60676-86-03.34951286.15000046.101933
HardenerPhenolic resinProprietary0.1667954.2900002.295732
PigmentCarbon black1333-86-40.0073870.1900000.101676
PolymerEpoxy resin systemProprietary0.3370908.6700004.639626
subTotal3.888000100.00000053.513562
Post-PlatingImpurityLead (Pb)7439-92-10.0000070.0045000.000102
Non hazardousProprietary0.0000910.0555000.001253
Tin solderTin (Sn)7440-31-50.16390299.9400002.255905
subTotal0.164000100.0000002.257259
WireImpurityNon hazardousProprietary0.0000020.0100000.000034
Pure metalCopper (Cu)7440-50-80.02444699.9900000.336463
subTotal0.024448100.0000000.336497
total7.265448100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.