Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PBSS5130PAP-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PBSS5130PAP-QSOT1118HUSON67.085448 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346648831151126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.06240080.0000000.880678
PolymerAcrylic resinProprietary0.01560020.0000000.220170
subTotal0.078000100.0000001.100848
DieDoped siliconSilicon (Si)7440-21-30.240000100.0000003.387224
subTotal0.240000100.0000003.387224
Lead FrameCopper alloyCopper (Cu)7440-50-82.55941095.11000036.122065
Magnesium (Mg)7439-95-40.0053820.2000000.075958
Nickel (Ni)7440-02-00.0853053.1700001.203942
Silicon (Si)7440-21-30.0185680.6900000.262057
Pure metal layerGold (Au)7440-57-50.0005380.0200000.007596
Nickel (Ni)7440-02-00.0199130.7400000.281046
Palladium (Pd)7440-05-30.0018840.0700000.026585
subTotal2.691000100.00000037.979250
Mould CompoundAdditiveNon hazardousProprietary0.0159410.4100000.224979
FillerSilica -amorphous-7631-86-90.0112750.2900000.159132
Silica fused60676-86-03.34951286.15000047.273115
HardenerPhenolic resinProprietary0.1667954.2900002.354053
PigmentCarbon black1333-86-40.0073870.1900000.104259
PolymerEpoxy resin systemProprietary0.3370908.6700004.757492
subTotal3.888000100.00000054.873030
Post-PlatingImpurityLead (Pb)7439-92-10.0000070.0045000.000104
Non hazardousProprietary0.0000910.0555000.001285
Tin solderTin (Sn)7440-31-50.16390299.9400002.313214
subTotal0.164000100.0000002.314603
WireImpurityNon hazardousProprietary0.0000020.0100000.000035
Pure metalCopper (Cu)7440-50-80.02444699.9900000.345011
subTotal0.024448100.0000000.345045
total7.085448100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.