Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PESD24VL1BLS-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PESD24VL1BLS-QSOD882BDDFN1006-20.90628 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934666337315212601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0144476.000001.59333
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0019910.470000.21950
Phenolic resinProprietary0.0025713.530000.28365
subTotal0.01900100.000002.09648
DieDoped siliconSilicon (Si)7440-21-30.04300100.000004.74467
subTotal0.04300100.000004.74467
Lead FrameCopper alloyCopper (Cu)7440-50-80.3776295.6000041.66703
Magnesium (Mg)7439-95-40.000590.150000.06538
Nickel (Ni)7440-02-00.011772.980001.29883
Silicon (Si)7440-21-30.002570.650000.28330
Pure metal layerGold (Au)7440-57-50.000040.010000.00436
Nickel (Ni)7440-02-00.002250.570000.24843
Palladium (Pd)7440-05-30.000160.040000.01743
subTotal0.39500100.0000043.58476
Mould CompoundFillerSilica -amorphous-7631-86-90.033767.980003.72461
Silica fused60676-86-00.3387980.0920037.38239
PigmentCarbon black1333-86-40.003930.928000.43314
PolymerEpoxy resin systemProprietary0.035748.450003.94398
Phenolic resinProprietary0.010792.550001.19020
subTotal0.42300100.0000046.67432
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000010.055500.00122
Tin solderTin (Sn)7440-31-50.0199999.940002.20550
subTotal0.02000100.000002.20682
WireImpurityNon hazardousProprietary0.000000.010000.00007
Pure metalGold (Au)7440-57-50.0062899.990000.69276
subTotal0.00628100.000000.69283
total0.90628100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.