Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PESD2CAN24XLT-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PESD2CAN24XLT-QSOT23TO-236AB8.05273 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346661662153126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.25700100.000003.19146
subTotal0.25700100.000003.19146
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.002460.090000.03059
Carbon (C)7440-44-00.001090.040000.01360
Chromium (Cr)7440-47-30.006020.220000.07477
Cobalt (Co)7440-48-40.011770.430000.14615
Iron (Fe)7439-89-61.3132147.9800016.30767
Manganese (Mn)7439-96-50.023540.860000.29230
Nickel (Ni)7440-02-00.9891536.1400012.28343
Phosphorus (P)7723-14-00.000550.020000.00680
Silicon (Si)7440-21-30.007120.260000.08837
Sulphur (S)7704-34-90.000550.020000.00680
Pure metal layerCopper (Cu)7440-50-80.3112011.370003.86449
Silver (Ag)7440-22-40.070342.570000.87350
subTotal2.73700100.0000033.98847
Mould CompoundAdditiveNon hazardousProprietary0.141082.900001.75201
Triphenylphosphine603-35-00.002430.050000.03021
FillerSilica -amorphous-7631-86-93.5028072.0000043.49829
PigmentCarbon black1333-86-40.002430.050000.03021
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.7297515.000009.06214
Phenol Formaldehyde resin (generic)9003-35-40.4865010.000006.04143
subTotal4.86500100.0000060.41429
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00011
Non hazardousProprietary0.000110.055500.00131
Tin solderTin (Sn)7440-31-50.1898999.940002.35803
subTotal0.19000100.000002.35945
WirePure metalCopper (Cu)7440-50-80.00372100.000000.04626
subTotal0.00372100.000000.04626
total8.05273100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.