Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PESD3V3L1BLF

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

12NC OPN Type No. Package State MSL
934668248515PESD3V3L1BLFZPESD3V3L1BLFSOD972-S1 (DFN0603)RFS1
REACHCompliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHSCompliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 65997-17-3: 38701 ppm; substance 1333-86-4: 3000 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 1333-86-4: 3000 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 5650 ppm;
RHF IndicatorLead-free and halogen-free according to Nexperia's halogen-free definition.
RHF-2006 indicator DEU/CN RoHS compliantHalogen-free
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
Substrate/Laminate 2FillerGlass Fibrous65997-17-30.00774043.9358903.870925
Substrate/Laminate 2PolymerResin system0.00673038.1611303.362156
Substrate/Laminate 2FillerNon hazardous0.00289016.4240401.447035
Substrate/Laminate 2AdditiveCalcium fluoride7789-75-50.0002601.4789400.130325
Core Total0.017620100.0000004.405221
Substrate/Laminate 2 Total0.017620100.0000008.810441
Substrate/Laminate 1Pure metalCopper (Cu)7440-50-80.012940100.0000006.470324
Foil Total0.012940100.0000002.065103
Substrate/Laminate 1 Total0.012940100.0000006.470324
InkAdditiveBarium sulfate (BaSO4)7727-43-70.02006037.16555010.029039
InkPolymerAcrylic resin0.01745032.3415108.727318
InkPolymerBisphenol A-formaldehyde copolymer25085-75-00.00620011.4812603.098399
InkAdditiveNon hazardous0.0030705.6811201.533289
InkAdditiveTalc14807-96-60.0030505.6429201.522979
InkFillerSilica -amorphous-7631-86-90.0030205.6055901.512909
InkPigmentCarbon black1333-86-40.0006001.1091300.299588
InkPolymer1,3,5-Triazine-2,4,6-triamine, polymer with formaldehyde, methylated68002-20-00.0005200.9729200.262828
Ink Total0.053970100.00000026.986349
DieDoped siliconSilicon (Si)7440-21-30.01120089.8365505.602058
DiePure metal layerSilver (Ag)7440-22-40.0011309.0106600.561728
DieAdditiveSilicon Dioxide (SiO2)14808-60-70.0001301.0700900.066548
DieImpurityNon hazardous0.0000100.0827000.004978
Die Total0.012470100.0000006.235312
Mould CompoundFillerSilica -amorphous-7631-86-90.07126071.65000035.629729
Mould CompoundPolymerPolyurethane resin9009-54-50.01790018.0000008.950949
Mould CompoundPolymerPolyimide resin0.0073107.3500003.654979
Mould CompoundPigmentNon hazardous0.0029803.0000001.491829
Mould Compound Total0.099450100.00000049.727486
Solder PasteTin alloyTin (Sn)7440-31-50.00354099.9899901.769869
Solder PasteImpurityNon hazardous0.0000000.0100100.000219
Solder Paste Total0.003540100.0000001.770088
PESD3V3L1BLF Total0.199990100.000000100.000000
Notes
Report created on 2024-10-26 17:50:35 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
Pb-free Soldering Pb Soldering No. of Processing Cycles
PPT MPPT PPT MPPT
260 °C40 s235 °C30 s3
Notes
Report created on 2024-10-26 17:50:35 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名称
Material
有毒或有害物质和元素 (Toxic or hazardous substances and elements)
铅 (Pb) 镉 (Cd) 汞 (Hg) 六价铬 (Cr6+) 多溴联苯 (PBB) 多溴二苯醚 (PBDE)
基板/层压板 (Substrate/Laminate 2)
基板/层压板 (Substrate/Laminate 1)
墨水 (Ink)
半导体芯片 (Die)
模封料 (Mould Compound)
锡膏 (Solder Paste)
表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 规定的限量要求以下
Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 规定的限量要求
Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
  该半导体产品具有无限期的环保使用期限(EFUP)。
This semiconductor product has an indefinite environmental friendly use period (EFUP).
Notes
Report created on 2024-10-26 17:50:35 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.