Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PHDMI2FS4

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PHDMI2FS4SOT1176-2XSON103.340686 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346663274711126030 sNA23520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.03150045.0000000.942920
PolymerAcrylic resinProprietary0.01050015.0000000.314307
Phenolic resinProprietary0.01050015.0000000.314307
Resin systemProprietary0.01750025.0000000.523845
subTotal0.070000100.0000002.095378
DieDoped siliconSilicon (Si)7440-21-30.055000100.0000001.646368
subTotal0.055000100.0000001.646368
Lead FrameCopper alloyCopper (Cu)7440-50-80.89860594.59000026.898817
Magnesium (Mg)7439-95-40.0016150.1700000.048343
Nickel (Ni)7440-02-00.0410404.3200001.228490
Silicon (Si)7440-21-30.0067450.7100000.201905
Pure metal layerGold (Au)7440-57-50.0002850.0300000.008531
Nickel (Ni)7440-02-00.0010450.1100000.031281
Palladium (Pd)7440-05-30.0004750.0500000.014219
Silver (Ag)7440-22-40.0001900.0200000.005687
subTotal0.950000100.00000028.437273
Mould CompoundFillerSilica -amorphous-7631-86-90.1575007.0000004.714601
Silica fused60676-86-01.86750083.00000055.901692
PigmentCarbon black1333-86-40.0112500.5000000.336757
PolymerEpoxy resin systemProprietary0.1350006.0000004.041086
Phenolic resinProprietary0.0787503.5000002.357300
subTotal2.250000100.00000067.351436
WireImpurityNon hazardousProprietary0.0000000.0000500.000000
Silver (Ag)7440-22-40.0000000.0014500.000007
Pure metalCopper (Cu)7440-50-80.01514596.5485500.453338
Pure metal layerGold (Au)7440-57-50.0000710.4499600.002113
Palladium (Pd)7440-05-30.0004712.9997000.014085
subTotal0.015686100.0000000.469543
total3.340686100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.