Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMBD914

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMBD914SOT23TO-236AB7.646837 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9338568702351512601235
9338568702151412601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.030000100.0000000.392319
subTotal0.030000100.0000000.392319
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0022940.0900000.030001
Carbon (C)7440-44-00.0010200.0400000.013334
Chromium (Cr)7440-47-30.0056080.2200000.073335
Cobalt (Co)7440-48-40.0109610.4300000.143336
Iron (Fe)7439-89-61.22301047.98000015.993674
Manganese (Mn)7439-96-50.0219210.8600000.286673
Nickel (Ni)7440-02-00.92120936.14000012.046923
Phosphorus (P)7723-14-00.0005100.0200000.006667
Silicon (Si)7440-21-30.0066270.2600000.086669
Sulphur (S)7704-34-90.0005100.0200000.006667
Pure metal layerCopper (Cu)7440-50-80.28982111.3700003.790081
Silver (Ag)7440-22-40.0655092.5700000.856685
subTotal2.549000100.00000033.334044
Mould CompoundAdditiveNon hazardousProprietary0.1414912.9000001.850321
Triphenylphosphine603-35-00.0024400.0500000.031902
FillerSilica -amorphous-7631-86-93.51288072.00000045.938994
PigmentCarbon black1333-86-40.0024400.0500000.031902
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.73185015.0000009.570624
Phenol Formaldehyde resin (generic)9003-35-40.48790010.0000006.380416
subTotal4.879000100.00000063.804159
Post-PlatingImpurityLead (Pb)7439-92-10.0000080.0045000.000109
Non hazardousProprietary0.0001030.0555000.001343
Tin solderTin (Sn)7440-31-50.18488999.9400002.417849
subTotal0.185000100.0000002.419301
WirePure metalCopper (Cu)7440-50-80.003837100.0000000.050174
subTotal0.003837100.0000000.050174
total7.646837100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.