Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMEG4020EPA-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMEG4020EPA-QSOT1061HUSON37.937050 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346683841151126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.08800080.0000001.108724
PolymerAcrylic resinProprietary0.02200020.0000000.277181
subTotal0.110000100.0000001.385905
DieDoped siliconSilicon (Si)7440-21-30.590000100.0000007.433492
subTotal0.590000100.0000007.433492
Lead FrameCopper alloyCopper (Cu)7440-50-82.58001492.94000032.505961
Magnesium (Mg)7439-95-40.0047190.1700000.059458
Nickel (Ni)7440-02-00.0860563.1000001.084232
Silicon (Si)7440-21-30.0194320.7000000.244826
Pure metal layerGold (Au)7440-57-50.0011100.0400000.013990
Nickel (Ni)7440-02-00.0774502.7900000.975808
Palladium (Pd)7440-05-30.0072180.2600000.090936
subTotal2.776000100.00000034.975211
Mould CompoundAdditiveNon hazardousProprietary0.0174660.4100000.220057
FillerSilica -amorphous-7631-86-90.0123540.2900000.155650
Silica fused60676-86-03.66999086.15000046.238716
HardenerPhenolic resinProprietary0.1827544.2900002.302543
PigmentCarbon black1333-86-40.0080940.1900000.101977
PolymerEpoxy resin systemProprietary0.3693428.6700004.653391
subTotal4.260000100.00000053.672334
Post-PlatingImpurityLead (Pb)7439-92-10.0000080.0045000.000096
Non hazardousProprietary0.0000940.0555000.001189
Tin solderTin (Sn)7440-31-50.16989899.9400002.140569
subTotal0.170000100.0000002.141854
WireImpurityNon hazardousProprietary0.0000030.0100000.000039
Pure metalCopper (Cu)7440-50-80.03104799.9900000.391167
subTotal0.031050100.0000000.391206
total7.937050100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.