Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PSMN7R0-30YLC

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PSMN7R0-30YLCSOT669LFPAK88.52000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340660071155126030 s126020 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.84000100.000000.94894
subTotal0.84000100.000000.94894
ClipCopper alloyCopper (Cu)7440-50-819.9740099.8700022.56439
Iron (Fe)7439-89-60.020000.100000.02259
Phosphorus (P)7723-14-00.006000.030000.00678
subTotal20.00000100.0000022.59376
Lead FrameCopper alloyCopper (Cu)7440-50-837.8379799.8100042.74511
Iron (Fe)7439-89-60.056860.150000.06424
Phosphorus (P)7723-14-00.015160.040000.01713
subTotal37.91000100.0000042.82648
Mould CompoundFillerSilica fused60676-86-013.7433061.0000015.52564
Flame retardantZinc Borate138265-88-02.2530010.000002.54519
PigmentCarbon black1333-86-40.067590.300000.07636
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-24.4384119.700005.01402
Phenolic resinProprietary2.027709.000002.29067
subTotal22.53000100.0000025.45188
Post-PlatingImpurityNon hazardousProprietary0.000380.010000.00043
Tin alloyTin (Sn)7440-31-53.8496299.990004.34886
subTotal3.85000100.000004.34929
Solder PasteLead alloyLead (Pb)7439-92-13.1357592.500003.54242
Silver (Ag)7440-22-40.084752.500000.09574
Tin (Sn)7440-31-50.169505.000000.19148
subTotal3.39000100.000003.82964
total88.52000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.