74AHCV541A
Parametrics
| Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name | ||
|---|---|---|---|---|---|---|---|---|---|---|
| 74AHCV541ABQ | 1.8 - 5.5 | CMOS | ± 16 | 60 | 8 | low | -40~125 | DHVQFN20 | ||
| 74AHCV541APW | 1.8 - 5.5 | CMOS | ± 16 | 60 | 8 | low | -40~125 | 101 | 45 | TSSOP20 |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| 74AHCV541ABQ | 74AHCV541ABQX (935306798115) |
Active | AHCV541A |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| 74AHCV541APW | 74AHCV541APWJ (935306648118) |
Active | AHV541A |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| 74AHCV541ABQ | 74AHCV541ABQX | 74AHCV541ABQ |
|
|
| 74AHCV541APW | 74AHCV541APWJ | 74AHCV541APW |
|
|
Documentation (11)
| File name | Title | Type | Date |
|---|---|---|---|
| 74AHCV541A | Octal buffer/line driver; 3-state | Data sheet | 2023-09-25 |
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| ahcv541a | 74AHCV541A IBIS model | IBIS model | 2016-03-24 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN20_SOT764-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
| SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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