Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

74AUP1G07

Low-power buffer with open-drain output

The 74AUP1G07 is a single buffer with open-drain output.

Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times.

This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V.

This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.

Features and benefits

  • Wide supply voltage range from 0.8 V to 3.6 V

  • High noise immunity

  • CMOS low power dissipation

  • Complies with JEDEC standards:

    • JESD8-12 (0.8 V to 1.3 V)

    • JESD8-11 (0.9 V to 1.65 V)

    • JESD8-7 (1.65 V to 1.95 V)

    • JESD8-5 (2.3 V to 2.7 V)

    • JESD8C (2.7 V to 3.6 V)

  • Low static power consumption; ICC = 0.9 μA (maximum)

  • Latch-up performance exceeds 100 mA per JESD 78 Class II

  • Overvoltage tolerant inputs to 3.6 V

  • Low noise overshoot and undershoot < 10 % of VCC

  • IOFF circuitry provides partial Power-down mode operation

  • Multiple package options

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

Parametrics

Type number VCC (V) Logic switching levels Output drive capability (mA) fmax (MHz) Nr of bits Power dissipation considerations Tamb (°C) Package name
74AUP1G07GM 0.8 - 3.6 CMOS 1.9 70 1 ultra low -40~125 XSON6
74AUP1G07GN 0.8 - 3.6 CMOS 1.9 70 1 ultra low -40~125 XSON6
74AUP1G07GS 0.8 - 3.6 CMOS 1.9 70 1 ultra low -40~125 XSON6
74AUP1G07GW 0.8 - 3.6 CMOS 1.9 70 1 ultra low -40~125 TSSOP5
74AUP1G07GX 0.8 - 3.6 CMOS 1.9 70 1 ultra low -40~125 X2SON5
74AUP1G07GX4 0.8 - 3.6 CMOS 1.9 70 1 ultra low -40~125 X2SON4

Package

Type number Orderable part number, (Ordering code (12NC)) Status Marking Package Package information Reflow-/Wave soldering Packing
74AUP1G07GM 74AUP1G07GM,115
(935279018115)		 Active pS SOT886
XSON6
(SOT886) 		SOT886 REFLOW_BG-BD-1
SOT886_115
74AUP1G07GM,132
(935279018132)		 Active pS SOT886_132
74AUP1G07GN 74AUP1G07GN,132
(935291716132)		 Active pS SOT1115
XSON6
(SOT1115) 		SOT1115 REFLOW_BG-BD-1
SOT1115_132
74AUP1G07GS 74AUP1G07GS,132
(935292831132)		 Active pS SOT1202
XSON6
(SOT1202) 		SOT1202 REFLOW_BG-BD-1
SOT1202_132
74AUP1G07GW 74AUP1G07GW,125
(935279017125)		 Active pS SOT353-1
TSSOP5
(SOT353-1) 		SOT353-1 WAVE_BG-BD-1
SOT353-1_125
74AUP1G07GX 74AUP1G07GX,125
(935297926125)		 Active pS SOT1226-3
X2SON5
(SOT1226-3) 		SOT1226-3 SOT1226-3_125
74AUP1G07GX4 74AUP1G07GX4Z
(935340115147)		 Active pS SOT1269-2
X2SON4
(SOT1269-2) 		SOT1269-2 SOT1269-2_147

Environmental information

Type number Orderable part number Chemical content RoHS RHF-indicator
74AUP1G07GM 74AUP1G07GM,115 74AUP1G07GM rohs rhf rhf
74AUP1G07GM 74AUP1G07GM,132 74AUP1G07GM rohs rhf rhf
74AUP1G07GN 74AUP1G07GN,132 74AUP1G07GN rohs rhf rhf
74AUP1G07GS 74AUP1G07GS,132 74AUP1G07GS rohs rhf rhf
74AUP1G07GW 74AUP1G07GW,125 74AUP1G07GW rohs rhf rhf
74AUP1G07GX 74AUP1G07GX,125 74AUP1G07GX rohs rhf rhf
74AUP1G07GX4 74AUP1G07GX4Z 74AUP1G07GX4 rohs rhf rhf
Quality and reliability disclaimer

Documentation (34)

File name Title Type Date
74AUP1G07 Low-power buffer with open-drain output Data sheet 2023-07-11
AN10161 PicoGate Logic footprints Application note 2002-10-29
AN11052 Pin FMEA for AUP family Application note 2019-01-09
mna623 Block diagram: 74AUP1G07GF, 74AUP1G07GM, 74AUP1G07GW, 74LVC1G07GF, 74LVC1G07GM, 74LVC1G07GV, 74LVC1G07GW Block diagram 2009-11-04
Nexperia_document_guide_MiniLogic_MicroPak_201808 MicroPak leadless logic portfolio guide Brochure 2018-09-03
Nexperia_document_guide_MiniLogic_PicoGate_201901 PicoGate leaded logic portfolio guide Brochure 2019-01-07
SOT886 3D model for products with SOT886 package Design support 2019-10-03
SOT1115 3D model for products with SOT1115 package Design support 2023-02-02
SOT1202 3D model for products with SOT1202 package Design support 2023-02-02
SOT353-1 3D model for products with SOT353-1 package Design support 2019-09-23
SOT1226-3 3D model for products with SOT1226-3 package Design support 2021-01-28
SOT1269-2 3D model for products with SOT1269-2 package Design support 2023-02-02
SOT1269 3D model for products with SOT1269 package Design support 2019-10-07
aup1g07 74AUP1G07 IBIS model IBIS model 2014-12-14
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 Leaflet 2019-04-12
Nexperia_document_leaflet_Logic_X2SON_packages_062018 X2SON ultra-small 4, 5, 6 & 8-pin leadless packages Leaflet 2018-06-05
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DFN1410-6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
XSON6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
XSON6_SOT1115_mk plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 0.9 mm x 1 mm x 0.35 mm body Marcom graphics 2017-01-28
TSSOP5_SOT353-1_mk plastic, thin shrink small outline package; 5 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body Marcom graphics 2018-07-25
XSON4_SOT1269-2_mk plastic, leadless thermal enhanced extremely thin outline package, no leads; 4 terminals; 0.4 mm pitch; 0.6 mm x 0.6 mm x 0.32 mm body Marcom graphics 2019-02-04
SOT886 plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Package information 2022-06-01
SOT1115 plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body Package information 2022-05-27
SOT1202 plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body Package information 2022-06-01
SOT353-1 plastic thin shrink small outline package; 5 leads; body width 1.25 mm Package information 2022-11-15
SOT1226-3 plastic thermal enhanced extremely thin small outline package; no leads;5 terminals; body 0.8 x 0.8 x 0.32 mm Package information 2020-08-27
SOT1269-2 plastic, leadless thermal enhanced extremely thin outline package, no leads; 4 terminals; 0.4 mm pitch; 0.6 mm x 0.6 mm x 0.32 mm body Package information 2020-08-18
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
Nexperia_Selection_guide_2023 Nexperia Selection Guide 2023 Selection guide 2023-05-10
MAR_SOT886 MAR_SOT886 Topmark Top marking 2013-06-03
MAR_SOT1115 MAR_SOT1115 Topmark Top marking 2013-06-03
MAR_SOT1202 MAR_SOT1202 Topmark Top marking 2013-06-03
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08

Support

If you are in need of design/technical support, let us know and fill in the answer form we'll get back to you shortly.

Models

File name Title Type Date
SOT886 3D model for products with SOT886 package Design support 2019-10-03
SOT1115 3D model for products with SOT1115 package Design support 2023-02-02
SOT1202 3D model for products with SOT1202 package Design support 2023-02-02
SOT353-1 3D model for products with SOT353-1 package Design support 2019-09-23
SOT1226-3 3D model for products with SOT1226-3 package Design support 2021-01-28
SOT1269-2 3D model for products with SOT1269-2 package Design support 2023-02-02
SOT1269 3D model for products with SOT1269 package Design support 2019-10-07
aup1g07 74AUP1G07 IBIS model IBIS model 2014-12-14

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