74AUP3G07
Low-power triple buffer with open-drain output
The 74AUP3G07 is a triple non-inverting buffer with open-drain output. The output of the device is an open drain and can be connected to other open-drain outputs to implement active-LOW wired-OR or active-HIGH wired-AND functions.
Schmitt-trigger action at all inputs makes the circuit tolerant to slower input rise and fall times across the entire VCC range from 0.8 V to 3.6 V.
This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V.
This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.
Features and benefits
Wide supply voltage range from 0.8 V to 3.6 V
High noise immunity
Complies with JEDEC standards:
JESD8-12 (0.8 V to 1.3 V)
JESD8-11 (0.9 V to 1.65 V)
JESD8-7 (1.2 V to 1.95 V)
JESD8-5 (1.8 V to 2.7 V)
JESD8-B (2.7 V to 3.6 V)
Low static power consumption; ICC = 0.9 μA (maximum)
Latch-up performance exceeds 100 mA per JESD 78B Class II
Inputs accept voltages up to 3.6 V
Low noise overshoot and undershoot < 10 % of VCC
IOFF circuitry provides partial Power-down mode operation
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
Specified from -40 °C to +85 °C and -40 °C to +125 °C
Parametrics
| Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|---|---|---|
| 74AUP3G07DC | 0.8 - 3.6 | CMOS | ± 1.9 | 70 | 3 | ultra low | -40~125 | VSSOP8 |
| 74AUP3G07GN | 0.8 - 3.6 | CMOS | ± 1.9 | 70 | 3 | ultra low | -40~125 | XSON8 |
| 74AUP3G07GS | 0.8 - 3.6 | CMOS | ± 1.9 | 70 | 3 | ultra low | -40~125 | XSON8 |
| 74AUP3G07GT | 0.8 - 3.6 | CMOS | ± 1.9 | 70 | 3 | ultra low | -40~125 | XSON8 |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| 74AUP3G07DC | 74AUP3G07DCH (935280698125) |
Active | p07 |
VSSOP8 (SOT765-1) |
SOT765-1 | SOT765-1_125 | |
| 74AUP3G07GN | 74AUP3G07GNX (935305802115) |
Active | p7 |
XSON8 (SOT1116) |
SOT1116 |
REFLOW_BG-BD-1
|
SOT1116_115 |
| 74AUP3G07GS | 74AUP3G07GSX (935305806115) |
Active | p7 |
XSON8 (SOT1203) |
SOT1203 |
REFLOW_BG-BD-1
|
SOT1203_115 |
| 74AUP3G07GT | 74AUP3G07GTX (935280699115) |
Active | p07 |
XSON8 (SOT833-1) |
SOT833-1 | SOT833-1_115 |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| 74AUP3G07DC | 74AUP3G07DCH | 74AUP3G07DC |
|
|
| 74AUP3G07GN | 74AUP3G07GNX | 74AUP3G07GN |
|
|
| 74AUP3G07GS | 74AUP3G07GSX | 74AUP3G07GS |
|
|
| 74AUP3G07GT | 74AUP3G07GTX | 74AUP3G07GT |
|
|
Documentation (21)
| File name | Title | Type | Date |
|---|---|---|---|
| 74AUP3G07 | Low-power triple buffer with open-drain output | Data sheet | 2023-07-31 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| SOT765-1 | 3D model for products with SOT765-1 package | Design support | 2020-01-22 |
| SOT1116 | 3D model for products with SOT1116 package | Design support | 2023-02-02 |
| SOT1203 | 3D model for products with SOT1203 package | Design support | 2023-02-02 |
| SOT833-1 | 3D model for products with SOT833-1 package | Design support | 2021-01-28 |
| aup3g07 | 74AUP3G07 IBIS model | IBIS model | 2015-06-04 |
| Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Leaflet | 2019-04-12 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| VSSOP8_SOT765-1_mk | plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body | Marcom graphics | 2017-01-28 |
| XSON8_SOT1203_mk | plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body | Marcom graphics | 2019-02-04 |
| SOT765-1 | plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body | Package information | 2022-06-03 |
| SOT1116 | plastic, leadless extremely thin small outline package; 8 terminals; 0.3 mm pitch; 1.2 mm x 1 mm x 0.35 mm body | Package information | 2022-06-02 |
| SOT1203 | plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body | Package information | 2022-06-03 |
| SOT833-1 | plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1 mm x 1.95 mm x 0.5 mm body | Package information | 2022-06-03 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| MAR_SOT1116 | MAR_SOT1116 Topmark | Top marking | 2013-06-03 |
| MAR_SOT1203 | MAR_SOT1203 Topmark | Top marking | 2013-06-03 |
| MAR_SOT833 | MAR_SOT833 Topmark | Top marking | 2013-06-03 |
Support
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Models
| File name | Title | Type | Date |
|---|---|---|---|
| SOT765-1 | 3D model for products with SOT765-1 package | Design support | 2020-01-22 |
| SOT1116 | 3D model for products with SOT1116 package | Design support | 2023-02-02 |
| SOT1203 | 3D model for products with SOT1203 package | Design support | 2023-02-02 |
| SOT833-1 | 3D model for products with SOT833-1 package | Design support | 2021-01-28 |
| aup3g07 | 74AUP3G07 IBIS model | IBIS model | 2015-06-04 |
Ordering, pricing & availability
Sample
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