74HC244-Q100; 74HCT244-Q100
Octal buffer/line driver; 3-state
The 74HC244-Q100; 74HCT244-Q100 is an 8-bit buffer/line driver with 3-state outputs. The device can be used as two 4-bit buffers or one 8-bit buffer. The device features two output enables (1OE and 2OE), each controlling four of the 3-state outputs. A HIGH on nOE causes the outputs to assume a high-impedance OFF-state. Inputs include clamp diodes that enable the use of current limiting resistors to interface inputs to voltages in excess of VCC.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Wide supply voltage range from 2.0 to 6.0 V
CMOS low power dissipation
High noise immunity
Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
Input levels:
For 74HC244-Q100: CMOS level
For 74HCT244-Q100: TTL level
Octal bus interface
Non-inverting 3-state outputs
Complies with JEDEC standards:
JESD8C (2.7 V to 3.6 V)
JESD7A (2.0 V to 6.0 V)
ESD protection:
MIL-STD-883, method 3015 exceeds 2 kV
HBM JESD22-A114F exceeds 2 kV
MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 Ω)
Multiple package options
DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints
Parametrics
| Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|---|---|---|
| 74HC244BQ-Q100 | 2.0 - 6.0 | CMOS | ± 7.8 | 36 | 8 | low | -40~125 | DHVQFN20 |
| 74HC244D-Q100 | 2.0 - 6.0 | CMOS | ± 7.8 | 36 | 8 | low | -40~125 | SO20 |
| 74HC244PW-Q100 | 2.0 - 6.0 | CMOS | ± 7.8 | 36 | 8 | low | -40~125 | TSSOP20 |
| 74HCT244BQ-Q100 | 4.5 - 5.5 | TTL | ± 6 | 36 | 8 | low | -40~125 | DHVQFN20 |
| 74HCT244D-Q100 | 4.5 - 5.5 | TTL | ± 6 | 36 | 8 | low | -40~125 | SO20 |
| 74HCT244PW-Q100 | 4.5 - 5.5 | TTL | ± 6 | 36 | 8 | low | -40~125 | TSSOP20 |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| 74HC244BQ-Q100 | 74HC244BQ-Q100,115 (935298912115) |
Active | HC244 |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| 74HC244D-Q100 | 74HC244D-Q100,118 (935298913118) |
Active | 74HC244D |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
SOT163-1_118 |
| 74HC244PW-Q100 | 74HC244PW-Q100,118 (935298914118) |
Active | HC244 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
| 74HCT244BQ-Q100 | 74HCT244BQ-Q100,11 (935298915115) |
Active | HCT244 |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| 74HCT244D-Q100 | 74HCT244D-Q100,118 (935298916118) |
Active | 74HCT244D |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
SOT163-1_118 |
| 74HCT244PW-Q100 | 74HCT244PW-Q100,11 (935298917118) |
Active | HCT244 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| 74HC244BQ-Q100 | 74HC244BQ-Q100,115 | 74HC244BQ-Q100 |
|
|
| 74HC244D-Q100 | 74HC244D-Q100,118 | 74HC244D-Q100 |
|
|
| 74HC244PW-Q100 | 74HC244PW-Q100,118 | 74HC244PW-Q100 |
|
|
| 74HCT244BQ-Q100 | 74HCT244BQ-Q100,11 | 74HCT244BQ-Q100 |
|
|
| 74HCT244D-Q100 | 74HCT244D-Q100,118 | 74HCT244D-Q100 |
|
|
| 74HCT244PW-Q100 | 74HCT244PW-Q100,11 | 74HCT244PW-Q100 |
|
|
Documentation (17)
| File name | Title | Type | Date |
|---|---|---|---|
| 74HC_HCT244_Q100 | Octal buffer/line driver; 3-state | Data sheet | 2021-07-28 |
| AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
| AN263 | Power considerations when using CMOS and BiCMOS logic devices | Application note | 2023-02-07 |
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN20_SOT764-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
| SOT163-1 | plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body | Package information | 2022-06-20 |
| SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Package information | 2022-06-21 |
| hc | HC/HCT Spice model | SPICE model | 2022-02-17 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| HCT_USER_GUIDE | HC/T User Guide | User manual | 1997-10-31 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
Support
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Models
| File name | Title | Type | Date |
|---|---|---|---|
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| hc | HC/HCT Spice model | SPICE model | 2022-02-17 |
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