74HC2GU04
Dual unbuffered inverter
The 74HC2GU04 is a dual unbuffered inverter. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC.
Features and benefits
Wide supply voltage range from 2.0 V to 6.0 V
CMOS low power dissipation
High noise immunity
Balanced propagation delays
Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
Complies with JEDEC standards
JESD8C (2.7 V to 3.6 V)
JESD7A (2.0 V to 6.0 V)
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
Specified from -40 °C to +85 °C and -40 °C to +125 °C
Parametrics
| Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|---|---|---|
| 74HC2GU04GV | 2.0 - 6.0 | CMOS | ± 2.6 | 36 | 2 | low | -40~125 | TSOP6 |
| 74HC2GU04GW | 2.0 - 6.0 | CMOS | ± 2.6 | 36 | 2 | low | -40~125 | TSSOP6 |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| 74HC2GU04GV | 74HC2GU04GV,125 (935281026125) |
Active | HU4 |
TSOP6 (SOT457) |
SOT457 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT457_125 |
| 74HC2GU04GW | 74HC2GU04GW,125 (935281027125) |
Active | PD |
TSSOP6 (SOT363-2) |
SOT363-2 | SOT363-2_125 |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| 74HC2GU04GV | 74HC2GU04GV,125 | 74HC2GU04GV |
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| 74HC2GU04GW | 74HC2GU04GW,125 | 74HC2GU04GW |
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Documentation (12)
| File name | Title | Type | Date |
|---|---|---|---|
| 74HC2GU04 | Dual unbuffered inverter | Data sheet | 2022-02-04 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| SOT457 | 3D model for products with SOT457 package | Design support | 2022-11-04 |
| SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| TSOP6_SOT457_mk | plastic, surface-mounted package (TSOP6); 6 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body | Marcom graphics | 2017-01-28 |
| SOT457 | plastic, surface-mounted package (SC-74; TSOP6); 6 leads | Package information | 2023-03-03 |
| SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| MAR_SOT457 | MAR_SOT457 Topmark | Top marking | 2013-06-03 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
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