74LVC1G175-Q100
Parametrics
| Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|---|---|---|
| 74LVC1G175GV-Q100 | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 3.1 | 300 | low | -40~125 | TSOP6 |
| 74LVC1G175GW-Q100 | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 3.1 | 300 | low | -40~125 | TSSOP6 |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| 74LVC1G175GV-Q100 | 74LVC1G175GV-Q100H (935301506125) |
Active | V75 |
TSOP6 (SOT457) |
SOT457 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT457_125 |
| 74LVC1G175GW-Q100 | 74LVC1G175GW-Q100H (935301507125) |
Active | YT |
TSSOP6 (SOT363-2) |
SOT363-2 | SOT363-2_125 |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| 74LVC1G175GV-Q100 | 74LVC1G175GV-Q100H | 74LVC1G175GV-Q100 |
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| 74LVC1G175GW-Q100 | 74LVC1G175GW-Q100H | 74LVC1G175GW-Q100 |
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Documentation (15)
| File name | Title | Type | Date |
|---|---|---|---|
| 74LVC1G175_Q100 | Single D-type flip-flop with reset; positive-edge trigger | Data sheet | 2023-08-15 |
| AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
| AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| SOT457 | 3D model for products with SOT457 package | Design support | 2022-11-04 |
| SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
| lvc1g175 | 74LVC1G175 IBIS model | IBIS model | 2014-10-20 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| TSOP6_SOT457_mk | plastic, surface-mounted package (TSOP6); 6 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body | Marcom graphics | 2017-01-28 |
| SOT457 | plastic, surface-mounted package (SC-74; TSOP6); 6 leads | Package information | 2023-03-03 |
| SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| MAR_SOT457 | MAR_SOT457 Topmark | Top marking | 2013-06-03 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
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