74LVC2G08-Q100
Dual 2-input AND gate
The 74LVC2G08-Q100 is a dual 2-input AND gate. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments.
Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times.
This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Wide supply voltage range from 1.65 V to 5.5 V
5 V tolerant outputs for interfacing with 5 V logic
Overvoltage tolerant inputs to 5.5 V
IOFF circuitry provides partial Power-down mode operation
High noise immunity
±24 mA output drive (VCC = 3.0 V)
CMOS low power dissipation
Complies with JEDEC standard:
JESD8-7 (1.65 V to 1.95 V)
JESD8-5 (2.3 V to 2.7 V)
JESD8-B/JESD36 (2.7 V to 3.6 V)
Latch-up performance exceeds 250 mA
Direct interface with TTL levels
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
Parametrics
| Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|---|---|---|---|
| 74LVC2G08DC-Q100 | 1.65 - 5.5 | CMOS/LVTTL | ± 24 | 2.1 | 150 | 2 | low | -40~125 | VSSOP8 |
| 74LVC2G08DP-Q100 | 1.65 - 5.5 | CMOS/LVTTL | ± 24 | 2.1 | 150 | 2 | low | -40~125 | TSSOP8 |
| 74LVC2G08GS-Q100 | 1.65 - 5.5 | CMOS/LVTTL | ± 24 | 2.1 | 150 | 2 | low | -40~125 | XSON8 |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| 74LVC2G08DC-Q100 | 74LVC2G08DC-Q100H (935301554125) |
Active | V08 |
VSSOP8 (SOT765-1) |
SOT765-1 | SOT765-1_125 | |
| 74LVC2G08DP-Q100 | 74LVC2G08DP-Q100H (935301555125) |
Active | V08 |
TSSOP8 (SOT505-2) |
SOT505-2 | SOT505-2_125 | |
| 74LVC2G08GS-Q100 | 74LVC2G08GS-Q100X (935690675115) |
Active | VE |
XSON8 (SOT1203) |
SOT1203 |
REFLOW_BG-BD-1
|
SOT1203_115 |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| 74LVC2G08DC-Q100 | 74LVC2G08DC-Q100H | 74LVC2G08DC-Q100 |
|
|
| 74LVC2G08DP-Q100 | 74LVC2G08DP-Q100H | 74LVC2G08DP-Q100 |
|
|
| 74LVC2G08GS-Q100 | 74LVC2G08GS-Q100X | 74LVC2G08GS-Q100 |
|
|
Documentation (20)
| File name | Title | Type | Date |
|---|---|---|---|
| 74LVC2G08_Q100 | Dual 2-input AND gate | Data sheet | 2023-08-16 |
| AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
| AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
| 001aah788 | Block diagram: 74AUP2G08DC, 74AUP2G08GD, 74AUP2G08GM, 74AUP2G08GT, 74LVC2G08DC, 74LVC2G08DP, 74LVC2G08GD, 74LVC2G08GM, 74LVC2G08GT | Block diagram | 2009-11-04 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| SOT765-1 | 3D model for products with SOT765-1 package | Design support | 2020-01-22 |
| SOT505-2 | 3D model for products with SOT505-2 package | Design support | 2019-01-18 |
| SOT1203 | 3D model for products with SOT1203 package | Design support | 2023-02-02 |
| lvc2g08 | 74LVC2G08 IBIS model | IBIS model | 2014-10-20 |
| Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| VSSOP8_SOT765-1_mk | plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body | Marcom graphics | 2017-01-28 |
| XSON8_SOT1203_mk | plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body | Marcom graphics | 2019-02-04 |
| SOT765-1 | plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body | Package information | 2022-06-03 |
| SOT505-2 | plastic, thin shrink small outline package; 8 leads; 0.65 mm pitch; 3 mm x 3 mm x 1.1 mm body | Package information | 2022-06-03 |
| SOT1203 | plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body | Package information | 2022-06-03 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| MAR_SOT1203 | MAR_SOT1203 Topmark | Top marking | 2013-06-03 |
Support
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Models
| File name | Title | Type | Date |
|---|---|---|---|
| SOT765-1 | 3D model for products with SOT765-1 package | Design support | 2020-01-22 |
| SOT505-2 | 3D model for products with SOT505-2 package | Design support | 2019-01-18 |
| SOT1203 | 3D model for products with SOT1203 package | Design support | 2023-02-02 |
| lvc2g08 | 74LVC2G08 IBIS model | IBIS model | 2014-10-20 |
Ordering, pricing & availability
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