BC69PAS series
Parametrics
| Type number | Package version | Package name | Size (mm) | channel type (e) | Ptot (mW) | VCEO [max] (V) | IC [max] (mA) | hFE [min] | hFE [max] | TJ [max] (°C) | fT [min] (MHz) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| BC69-16PAS | SOT1061D | DFN2020D-3 | 2 x 2 x 0.65 | PNP | 420.0 | -20.0 | -2000.0 | 100.0 | 250.0 | 150 | 40.0 |
| BC69-25PAS | SOT1061D | DFN2020D-3 | 2 x 2 x 0.65 | PNP | 420.0 | -20.0 | -2000.0 | 160.0 | 375.0 | 150 | 40.0 |
| BC69PAS | SOT1061D | DFN2020D-3 | 2 x 2 x 0.65 | PNP | 420.0 | -20.0 | -2000.0 | 85.0 | 375.0 | 150 | 40.0 |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| BC69-16PAS | BC69-16PASX (934068112115) |
Active | C2 |
DFN2020D-3 (SOT1061D) |
SOT1061D |
REFLOW_BG-BD-1
|
SOT1061D_115 |
| BC69-25PAS | BC69-25PASX (934068113115) |
Active | C3 |
DFN2020D-3 (SOT1061D) |
SOT1061D |
REFLOW_BG-BD-1
|
SOT1061D_115 |
| BC69PAS | BC69PASX (934068111115) |
Active | C1 |
DFN2020D-3 (SOT1061D) |
SOT1061D |
REFLOW_BG-BD-1
|
SOT1061D_115 |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| BC69-16PAS | BC69-16PASX | BC69-16PAS |
|
|
| BC69-25PAS | BC69-25PASX | BC69-25PAS |
|
|
| BC69PAS | BC69PASX | BC69PAS |
|
|
Documentation (11)
| File name | Title | Type | Date |
|---|---|---|---|
| AN90023 | Thermal performance of DFN packages | Application note | 2020-11-23 |
| AN90023_ZH | Thermal performance of DFN packages | Application note | 2021-02-26 |
| Nexperia_asset_document_brochure_autoDFN_CN_LR | 小巧轻便的汽车 二极管和晶体管 | Brochure | 2022-04-26 |
| SOT1061D | 3D model for products with SOT1061D package | Design support | 2021-07-30 |
| Nexperia_AutoDFN_factsheet_2022 | Small & light automotive diodes and transistors | Leaflet | 2022-04-13 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN2020D-3_SOT1061D_mk | plastic, thermal enhanced ultra thin small outline package; no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body | Marcom graphics | 2017-01-28 |
| SOT1061D | plastic, leadless thermal enhanced ultra thin small outline package with side-wettable flanks (SWF); no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body | Package information | 2022-10-10 |
| BC69PAS_Nexperia_Product_Reliability | BC69PAS Nexperia Product Reliability | Quality document | 2024-04-23 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| BC69PAS | BC69PAS SPICE model | SPICE model | 2024-08-27 |
Support
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Ordering, pricing & availability
Sample
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