NXB0104-Q100
Parametrics
| Type number | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|---|---|---|---|
| NXB0104BQ-Q100 | 1.2 - 3.6 | 1.65 - 5.5 | CMOS | ± 0.02 | 5.5 | 4 | low | -40~125 | DHVQFN14 |
| NXB0104GU12-Q100 | 1.2 - 3.6 | 1.65 - 5.5 | CMOS | ± 0.02 | 5.5 | 4 | low | -40~125 | XQFN12 |
| NXB0104PW-Q100 | 1.2 - 3.6 | 1.65 - 5.5 | CMOS | ± 0.02 | 5.5 | 4 | low | -40~125 | TSSOP14 |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| NXB0104BQ-Q100 | NXB0104BQ-Q100X (935690881115) |
Active | B0104 |
DHVQFN14 (SOT762-1) |
SOT762-1 | SOT762-1_115 | |
| NXB0104GU12-Q100 | NXB0104GU12-Q100X (935691323115) |
Active |
XQFN12 (SOT1174-1) |
SOT1174-1 | SOT1174-1_115 | ||
| NXB0104PW-Q100 | NXB0104PW-Q100J (935690879118) |
Active | NXB0104 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| NXB0104BQ-Q100 | NXB0104BQ-Q100X | NXB0104BQ-Q100 |
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| NXB0104GU12-Q100 | NXB0104GU12-Q100X | NXB0104GU12-Q100 |
|
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| NXB0104PW-Q100 | NXB0104PW-Q100J | NXB0104PW-Q100 |
|
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Documentation (12)
| File name | Title | Type | Date |
|---|---|---|---|
| NXB0104_Q100 | Dual supply translating transceiver; auto direction sensing; 3-state | Data sheet | 2024-04-04 |
| SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
| SOT1174-1 | 3D model for products with SOT1174-1 package | Design support | 2021-01-28 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| nxb0104 | NXB0104 IBIS model | IBIS model | 2019-09-12 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN14_SOT762-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; 0.5 mm pitch; 2.5 mm x 3 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT762-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body | Package information | 2023-04-05 |
| SOT1174-1 | plastic, leadless extremely thin quad flat package; 12 terminals; 0.4 mm pitch; 2 mm x 1.7 mm x 0.5 mm body | Package information | 2024-04-11 |
| SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
Support
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Models
| File name | Title | Type | Date |
|---|---|---|---|
| SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
| SOT1174-1 | 3D model for products with SOT1174-1 package | Design support | 2021-01-28 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| nxb0104 | NXB0104 IBIS model | IBIS model | 2019-09-12 |
Ordering, pricing & availability
Sample
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