NXB0108
Parametrics
| Type number | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name | Category | |||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXB0108BQ | 1.2 - 3.6 | 1.65 - 5.5 | CMOS | ± 0.02 | 5.5 | 8 | low | -40~125 | DHVQFN20 | Bi-directional | AutoSense | |||
| NXB0108PW | 1.2 - 3.6 | 1.65 - 5.5 | CMOS | ± 0.02 | 5.5 | 8 | low | -40~125 | 92 | 2.3 | 35 | TSSOP20 | Bi-directional | AutoSense |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| NXB0108BQ | NXB0108BQX (935289745115) |
Active | NXB0108B |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| NXB0108PW | NXB0108PWJ (935289746118) |
Active | NXB0108 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| NXB0108BQ | NXB0108BQX | NXB0108BQ |
|
|
| NXB0108PW | NXB0108PWJ | NXB0108PW |
|
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Documentation (10)
| File name | Title | Type | Date |
|---|---|---|---|
| NXB0108 | Dual supply translating transceiver; auto direction sensing; 3-state | Data sheet | 2024-07-31 |
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| nxb0108 | NXB0108 IBIS model | IBIS model | 2020-10-30 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN20_SOT764-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
| SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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