NXS0104
Parametrics
| Type number | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name | Category | |||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXS0104BQ | 1.65 - 3.6 | 2.3 - 5.5 | CMOS | - 0.02 / 1.0 | 6.0 | 4 | low | -40~125 | DHVQFN14 | Bi-directional | AutoSense | |||
| NXS0104GU12 | 1.65 - 3.6 | 2.3 - 5.5 | CMOS | - 0.02 / 1.0 | 6.0 | 4 | low | -40~125 | 135 | 4.2 | 58 | XQFN12 | Bi-directional | AutoSense |
| NXS0104PW | 1.65 - 3.6 | 2.3 - 5.5 | CMOS | - 0.02 / 1.0 | 6.0 | 4 | low | -40~125 | TSSOP14 | Bi-directional | AutoSense | |||
| NXS0104UM | 1.65 - 3.6 | 2.3 - 5.5 | CMOS | - 0.02 / 1.0 | 6.0 | 4 | low | -40~125 | WLCSP12 | Bi-directional | AutoSense |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| NXS0104BQ | NXS0104BQX (935690692115) |
Active | S0104 |
DHVQFN14 (SOT762-1) |
SOT762-1 | SOT762-1_115 | |
| NXS0104GU12 | NXS0104GU12X (935690693115) |
Active |
XQFN12 (SOT1174-1) |
SOT1174-1 | SOT1174-1_115 | ||
| NXS0104PW | NXS0104PWJ (935690691118) |
Active | NXS0104 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
| NXS0104UM | NXS0104UMAZ (935691108336) |
Active | m4 |
WLCSP12 (SOT8019-1) |
SOT8019-1 | SOT8019-1_336 |
All type numbers in the table below are discontinued.
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| NXS0104UM | NXS0104UMZ (935691108084) |
Withdrawn / End-of-life | m4 |
WLCSP12 (SOT8019-1) |
SOT8019-1 | Not available |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| NXS0104BQ | NXS0104BQX | NXS0104BQ |
|
|
| NXS0104GU12 | NXS0104GU12X | NXS0104GU12 |
|
|
| NXS0104PW | NXS0104PWJ | NXS0104PW |
|
|
| NXS0104UM | NXS0104UMAZ | NXS0104UM |
|
|
All type numbers in the table below are discontinued.
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| NXS0104UM | NXS0104UMZ | NXS0104UM |
|
|
Documentation (16)
| File name | Title | Type | Date |
|---|---|---|---|
| NXS0104 | Dual supply translating transceiver; open drain; auto direction sensing | Data sheet | 2024-04-04 |
| AN90014 | Pin FMEA for NXS family | Application note | 2020-03-25 |
| AN90032 | Low temperature soldering, application study | Application note | 2022-02-22 |
| SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
| SOT1174-1 | 3D model for products with SOT1174-1 package | Design support | 2021-01-28 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| SOT8019-1 | 3D model for products with SOT8019-1 package | Design support | 2023-02-07 |
| nxs0104 | NXS0104 IBIS model | IBIS model | 2020-11-05 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN14_SOT762-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; 0.5 mm pitch; 2.5 mm x 3 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT762-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body | Package information | 2023-04-05 |
| SOT1174-1 | plastic, leadless extremely thin quad flat package; 12 terminals; 0.4 mm pitch; 2 mm x 1.7 mm x 0.5 mm body | Package information | 2024-04-11 |
| SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
| SOT8019-1 | wafer level chip-scale package, 12 bumps; 1.36 x 1.86 x 0.60 mm | Package information | 2022-02-11 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
Support
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Models
| File name | Title | Type | Date |
|---|---|---|---|
| SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
| SOT1174-1 | 3D model for products with SOT1174-1 package | Design support | 2021-01-28 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| SOT8019-1 | 3D model for products with SOT8019-1 package | Design support | 2023-02-07 |
| nxs0104 | NXS0104 IBIS model | IBIS model | 2020-11-05 |
Ordering, pricing & availability
Sample
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If you do not have a direct account with Nexperia our network of global and regional distributors is available and equipped to support you with Nexperia samples. Check out the list of official distributors.