74LVC373A
Parametrics
Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|
74LVC373ABQ | 1.2 - 3.6 | TTL | ± 24 | 3.0 | low | -40~125 | DHVQFN20 |
74LVC373AD | 1.2 - 3.6 | TTL | ± 24 | 3.0 | low | -40~125 | SO20 |
74LVC373APW | 1.2 - 3.6 | TTL | ± 24 | 3.0 | low | -40~125 | TSSOP20 |
Package
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
74LVC373ABQ | 74LVC373ABQ,115 (935275055115) |
Active | LVC373A |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
74LVC373AD | 74LVC373AD,118 (935218630118) |
Active | 74LVC373AD |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
SOT163-1_118 |
74LVC373APW | 74LVC373APW,118 (935218650118) |
Active | LVC373A |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
All type numbers in the table below are discontinued.
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
74LVC373AD | 74LVC373AD,112 (935218630112) |
Withdrawn / End-of-life | 74LVC373AD |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
Not available |
74LVC373ADB | 74LVC373ADB,112 (935218640112) |
Obsolete | LVC373A |
SSOP20 (SOT339-1) |
SOT339-1 |
SSOP-TSSOP-VSO-WAVE
|
Not available |
74LVC373ADB,118 (935218640118) |
Obsolete | LVC373A | SOT339-1_118 | ||||
74LVC373APW | 74LVC373APW,112 (935218650112) |
Withdrawn / End-of-life | LVC373A |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
Not available |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
74LVC373ABQ | 74LVC373ABQ,115 | 74LVC373ABQ | ||
74LVC373AD | 74LVC373AD,118 | 74LVC373AD | ||
74LVC373APW | 74LVC373APW,118 | 74LVC373APW |
All type numbers in the table below are discontinued.
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
74LVC373AD | 74LVC373AD,112 | 74LVC373AD | ||
74LVC373ADB | 74LVC373ADB,112 | 74LVC373ADB | ||
74LVC373ADB | 74LVC373ADB,118 | 74LVC373ADB | ||
74LVC373APW | 74LVC373APW,112 | 74LVC373APW |
Documentation (19)
File name | Title | Type | Date |
---|---|---|---|
74LVC373A | Octal D-type transparent latch with 5 V tolerant inputs/outputs; 3-state | Data sheet | 2023-08-28 |
AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
AN263 | Power considerations when using CMOS and BiCMOS logic devices | Application note | 2023-02-07 |
mna883 | Block diagram: 74LVC373ABQ, 74LVC373AD, 74LVC373ADB, 74LVC373APW | Block diagram | 2009-11-03 |
SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
lvc373a | lvc373a IBIS model | IBIS model | 2013-04-09 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DHVQFN20_SOT764-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
SOT163-1 | plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body | Package information | 2024-11-15 |
SOT339-1 | plastic, shrink small outline package; 20 leads; 0.65 mm pitch; 7.2 mm x 5.3 mm x 2 mm body | Package information | 2020-04-21 |
SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 |
lvc | lvc Spice model | SPICE model | 2013-05-07 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
Support
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Models
File name | Title | Type | Date |
---|---|---|---|
SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
lvc373a | lvc373a IBIS model | IBIS model | 2013-04-09 |
lvc | lvc Spice model | SPICE model | 2013-05-07 |
Ordering, pricing & availability
Sample
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