CBTD16210
Parametrics
| Type number |
|---|
Package
All type numbers in the table below are discontinued.
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| CBTD16210DGG | CBTD16210DGG,512 (935268484512) |
Obsolete | CBTD16210DGG |
TSSOP48 (SOT362-1) |
SOT362-1 |
SSOP-TSSOP-VSO-WAVE
|
Not available |
| CBTD16210DGG,518 (935268484518) |
Obsolete | CBTD16210DGG | Not available | ||||
| CBTD16210DL | CBTD16210DL,512 (935269668512) |
Obsolete | CBTD16210DL Standard Procedure Standard Procedure |
SSOP48 (SOT370-1) |
SOT370-1 |
SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE |
Not available |
| CBTD16210DL,518 (935269668518) |
Obsolete | CBTD16210DL Standard Procedure Standard Procedure | Not available |
Environmental information
All type numbers in the table below are discontinued.
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| CBTD16210DGG | CBTD16210DGG,512 | CBTD16210DGG |
|
|
| CBTD16210DGG | CBTD16210DGG,518 | CBTD16210DGG |
|
|
| CBTD16210DL | CBTD16210DL,512 | CBTD16210DL |
|
|
| CBTD16210DL | CBTD16210DL,518 | CBTD16210DL |
|
|
Documentation (11)
| File name | Title | Type | Date |
|---|---|---|---|
| CBTD16210 | 20-bit level shifting bus switch with 10-bit output enables | Data sheet | 2000-10-11 |
| AN90010 | Pin FMEA for CBT(D) family | Application note | 2019-10-28 |
| SOT362-1 | 3D model for products with SOT362-1 package | Design support | 2020-01-22 |
| cbtd16210 | cbtd16210 IBIS model | IBIS model | 2013-04-08 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| TSSOP48_SOT362-1_mk | plastic, thin shrink small outline package; 48 leads; 0.5 mm pitch; 12.8 mm x 6.1 mm x 1.2 mm body | Marcom graphics | 2017-01-28 |
| SOT362-1 | plastic thin shrink small outline package; 48 leads; body width 6.1 mm | Package information | 2024-01-05 |
| SOT370-1 | plastic, shrink small outline package; 48 leads; 0.635 mm pitch; 15.9 mm x 7.5 mm x 2.8 mm body | Package information | 2020-04-21 |
| SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
Support
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Ordering, pricing & availability
Sample
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