74AUP2G97
Applications
The 74AUP2G97 is a dual configurable multiple function gate with Schmitt-trigger inputs. Each gate within the device can be configured as any of the following logic functions MUX, AND, OR, NAND, NOR, inverter and buffer; using the 3-bit input. All inputs can be connected directly to VCC or GND.
This device ensures very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V.
This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.
Features and benefits
- Wide supply voltage range from 0.8 V to 3.6 V
- High noise immunity
- ESD protection:
- HBM JESD22-A114F exceeds 5000 V
- MM JESD22-A115-A exceeds 200 V
- CDM JESD22-C101E exceeds 1000 V
- Low static power consumption; ICC = 0.9 μA (maximum)
- Latch-up performance exceeds 100 mA per JESD 78 Class II
- Inputs accept voltages up to 3.6 V
- Low noise overshoot and undershoot < 10 % of VCC
- IOFF circuitry provides partial power-down mode operation
- Multiple package options
- Specified from ‑40 °C to +85 °C and ‑40 °C to +125 °C
Parametrics
Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|---|---|
74AUP2G97DP | 0.8 - 3.6 | CMOS | ± 1.9 | 8.7 | 70 | 2 | ultra low | -40~125 | TSSOP10 |
74AUP2G97GU | 0.8 - 3.6 | CMOS | ± 1.9 | 8.7 | 70 | 2 | ultra low | -40~125 | XQFN10 |
Package
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
74AUP2G97DP | 74AUP2G97DPJ (935304481118) |
Active | aV |
TSSOP10 (SOT552-1) |
SOT552-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT552-1_118 |
74AUP2G97GU | 74AUP2G97GUX (935304484115) |
Active | aV |
XQFN10 (SOT1160-1) |
SOT1160-1 | SOT1160-1_115 |
All type numbers in the table below are discontinued.
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
74AUP2G97GF | 74AUP2G97GFX (935304482115) |
Obsolete | aV |
XSON10 (SOT1081-2) |
SOT1081-2 | Not available |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
74AUP2G97DP | 74AUP2G97DPJ | 74AUP2G97DP | ||
74AUP2G97GU | 74AUP2G97GUX | 74AUP2G97GU |
All type numbers in the table below are discontinued.
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
74AUP2G97GF | 74AUP2G97GFX | 74AUP2G97GF |
Documentation (14)
File name | Title | Type | Date |
---|---|---|---|
74AUP2G97 | Low-power dual PCB configurable multiple function gate | Data sheet | 2023-08-01 |
Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
SOT552-1 | 3D model for products with SOT552-1 package | Design support | 2020-01-22 |
SOT1160-1 | 3D model for products with SOT1160-1 package | Design support | 2019-10-03 |
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Leaflet | 2019-04-12 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
TSSOP10_SOT552_mk | plastic, thin shrink small outline package; 10 leads; 0.5 mm pitch; 3 mm x 3 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
XQFN10_SOT1160-1_mk | plastic, extremely thin quad flat package; no leads; 10 terminals; 0.4 mm pitch; 1.4 mm x 1.8 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
SOT552-1 | plastic, thin shrink small outline package; 10 leads; 0.5 mm pitch; 3 mm x 3 mm x 1.1 mm body | Package information | 2022-06-07 |
SOT1081-2 | plastic, leadless extremely thin small outline package; 10 terminals; 0.35 mm pitch; 1.7 mm x 1 mm x 0.5 mm body | Package information | 2020-04-21 |
SOT1160-1 | plastic, leadless extremely thin quad flat package; 10 terminals; 0.4 mm pitch; 1.4 mm x 1.8 mm x 0.5 mm body | Package information | 2022-06-07 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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