74CBTLV3125-Q100
Parametrics
| Type number | VCC (V) | RON (Ω) | Logic switching levels | tpd (ns) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|
| 74CBTLV3125BQ-Q100 | 2.3 - 3.6 | 7 | CMOS/LVTTL | 0.2 | very low | -40~125 | 107 | 21.3 | 75 | DHVQFN14 |
| 74CBTLV3125PW-Q100 | 2.3 - 3.6 | 7 | CMOS/LVTTL | 0.2 | very low | -40~125 | 141 | 8 | 68 | TSSOP14 |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| 74CBTLV3125BQ-Q100 | 74CBTLV3125BQ-Q10X (935690957115) |
Active | V3125 |
DHVQFN14 (SOT762-1) |
SOT762-1 | SOT762-1_115 | |
| 74CBTLV3125PW-Q100 | 74CBTLV3125PW-Q10J (935337258118) |
Active | TLV3125 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| 74CBTLV3125BQ-Q100 | 74CBTLV3125BQ-Q10X | 74CBTLV3125BQ-Q100 |
|
|
| 74CBTLV3125PW-Q100 | 74CBTLV3125PW-Q10J | 74CBTLV3125PW-Q100 |
|
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Documentation (11)
| File name | Title | Type | Date |
|---|---|---|---|
| 74CBTLV3125_Q100 | 4-bit bus switch | Data sheet | 2024-04-11 |
| SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| cbtlv3125 | 74CBTLV3125 IBIS model | IBIS model | 2015-02-23 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN14_SOT762-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; 0.5 mm pitch; 2.5 mm x 3 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT762-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body | Package information | 2023-04-05 |
| SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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Ordering, pricing & availability
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