74LVC32A-Q100
Parametrics
| Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name | |||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74LVC32ABQ-Q100 | 1.2 - 3.6 | CMOS/LVTTL | ± 24 | 2.1 | 150 | 4 | low | -40~125 | DHVQFN14 | |||
| 74LVC32AD-Q100 | 1.2 - 3.6 | CMOS/LVTTL | ± 24 | 2.1 | 150 | 4 | low | -40~125 | SO14 | |||
| 74LVC32APW-Q100 | 1.2 - 3.6 | CMOS/LVTTL | ± 24 | 2.1 | 150 | 4 | low | -40~125 | 112 | 22 | 70 | TSSOP14 |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| 74LVC32ABQ-Q100 | 74LVC32ABQ-Q100X (935299312115) |
Active | VC32A |
DHVQFN14 (SOT762-1) |
SOT762-1 | SOT762-1_115 | |
| 74LVC32AD-Q100 | 74LVC32AD-Q100J (935299313118) |
Active | 74LVC32AD |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_118 |
| 74LVC32APW-Q100 | 74LVC32APW-Q100J (935299314118) |
Active | LVC32A |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
All type numbers in the table below are discontinued.
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| 74LVC32ADB-Q100 | 74LVC32ADB-Q100J (935300462118) |
Obsolete | LVC32A |
SSOP14 (SOT337-1) |
SOT337-1 |
SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE |
SOT337-1_118 |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| 74LVC32ABQ-Q100 | 74LVC32ABQ-Q100X | 74LVC32ABQ-Q100 |
|
|
| 74LVC32AD-Q100 | 74LVC32AD-Q100J | 74LVC32AD-Q100 |
|
|
| 74LVC32APW-Q100 | 74LVC32APW-Q100J | 74LVC32APW-Q100 |
|
|
All type numbers in the table below are discontinued.
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| 74LVC32ADB-Q100 | 74LVC32ADB-Q100J | 74LVC32ADB-Q100 |
|
|
Documentation (24)
| File name | Title | Type | Date |
|---|---|---|---|
| 74LVC32A_Q100 | Quad 2-input OR gate | Data sheet | 2024-02-22 |
| AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
| AN263 | Power considerations when using CMOS and BiCMOS logic devices | Application note | 2023-02-07 |
| mna242 | Block diagram: 74AHC32BQ, 74AHC32D, 74AHC32PW, 74AHCT32BQ, 74AHCT32D, 74AHCT32PW, 74ALVC32BQ, 74ALVC32D, 74ALVC32PW, 74HC32BQ, 74HC32D, 74HC32DB, 74HC32N, 74HC32PW, 74HCT32BQ, 74HCT32D, 74HCT32DB, 74HCT32N, 74HCT32PW, 74LVC32ABQ, 74LVC32AD, 74LVC32ADB, 74LVC32APW | Block diagram | 2009-11-04 |
| SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
| SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| lvc32a | lvc32a IBIS model | IBIS model | 2013-04-09 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN14_SOT762-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; 0.5 mm pitch; 2.5 mm x 3 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| SO14_SOT108-1_mk | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
| SSOP14_SOT337-1_mk | plastic, shrink small outline package; 14 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Marcom graphics | 2017-01-28 |
| TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT762-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body | Package information | 2023-04-05 |
| SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT337-1 | plastic, shrink small outline package; 14 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Package information | 2020-04-21 |
| SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| lvc | lvc Spice model | SPICE model | 2013-05-07 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
Support
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Models
| File name | Title | Type | Date |
|---|---|---|---|
| SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
| SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| lvc32a | lvc32a IBIS model | IBIS model | 2013-04-09 |
| lvc | lvc Spice model | SPICE model | 2013-05-07 |
Ordering, pricing & availability
Sample
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