HEF40175B
Parametrics
Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|---|
HEF40175BT | 3.0 - 15 | CMOS | ± 2.4 | 25 | 45 | low | -40~85 | SO16 |
HEF40175BTT | 3.0 - 15 | CMOS | ± 2.4 | 25 | 45 | low | -40~85 | TSSOP16 |
Package
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
HEF40175BT | HEF40175BT,653 (933373470653) |
Active | HEF40175BT |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
Not available |
HEF40175BTT | HEF40175BTT,118 (935294421118) |
Active | HF40175 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
HEF40175BT | HEF40175BT,653 | HEF40175BT | ||
HEF40175BTT | HEF40175BTT,118 | HEF40175BTT |
Documentation (15)
File name | Title | Type | Date |
---|---|---|---|
HEF40175B | Quad D-type flip-flop | Data sheet | 2024-08-08 |
AN11051 | Pin FMEA HEF4000 family | Application note | 2019-01-09 |
mgr497 | Block diagram: HEF40175BP, HEF40175BT | Block diagram | 2009-11-04 |
SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
SO16_SOT109-1_mk | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body | Marcom graphics | 2017-01-28 |
TSSOP16_SOT403-1_mk | plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
SOT109-1 | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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Ordering, pricing & availability
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