Package information
| Package information | Package name | Package description | Reference | Date |
|---|---|---|---|---|
| OL-IP3319CX6 | WLCSP6 | Wafer level chip-size package; 6 bumps (2 x 3); 0.4 mm pitch; 0.95 mm x 1.34 mm x 0.6 mm body | 2013-06-11 |
Related documents
| File name | Title | Type | Date |
|---|---|---|---|
| OL-IP3319CX6 | 3D model for products with OL-IP3319CX6 package | Design support | 2023-03-13 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| OL-IP3319CX6 | Wafer level chip-size package; 6 bumps (2 x 3); 0.4 mm pitch; 0.95 mm x 1.34 mm x 0.6 mm body | Package information | 2022-07-13 |
Products in this package
ESD protection, TVS, filtering and signal conditioning
| Type number | Description | Quick access |
|---|---|---|
| IP3319CX6 | Single-channel common-mode filter with integrated ESD protection network |