Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

OL-IP4369CX4

OL-IP4369CX4

wafer level chip-size package; 4 bumps (2 x 2); 0.4 mm pitch; 0.76 mm x 0.76 mm x 0.47 mm body

Package information

Package information Package name Package description Reference Date
OL-IP4369CX4 WLCSP4 wafer level chip-size package; 4 bumps (2 x 2); 0.4 mm pitch; 0.76 mm x 0.76 mm x 0.47 mm body 2007-05-25

Related documents

File name Title Type Date
OL-IP4369CX4 3D model for products with OL-IP4369CX4 package Design support 2023-03-13
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
OL-IP4369CX4 wafer level chip-size package; 4 bumps (2 x 2); 0.4 mm pitch; 0.76 mm x 0.76 mm x 0.47 mm body Package information 2020-04-21

Products in this package

ESD protection, TVS, filtering and signal conditioning

Type number Description Quick access
IP4369CX4 ESD protection for high-speed interfaces