Package information
| Package information | Package name | Package description | Reference | Date |
|---|---|---|---|---|
| OL-PMCM6501FNE | WLCSP6 | WLCSP6: wafer level chip-size package; 6 bumps (3 x 2) | 2015-07-20 |
Related documents
| File name | Title | Type | Date |
|---|---|---|---|
| OL-PMCM6501VPE | 3D model for products with OL-PMCM6501VPE package | Design support | 2023-03-13 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| OL-PMCM6501FNE | wafer level chip-scale package; 6 bumps; 1.48 x 0.98 x 0.35 mm | Package information | 2020-12-14 |
| OL-PMCM6501VPE | WLCSP6: wafer level chip-size package; 6 bumps (3 x 2) | Package information | 2020-04-21 |
Products in this package
MOSFETs
| Type number | Description | Quick access |
|---|---|---|
| PMCM6501VPE | 12 V, P-channel Trench MOSFET |