Package information
| Package information | Package name | Package description | Reference | Date |
|---|---|---|---|---|
| SOT8025-1 | WLCSP16 | wafer level chip-scale package; 16 bumps; 1.455 mm x 1.455 mm x 0.43 mm bod | 2021-06-16 |
Related documents
| File name | Title | Type | Date |
|---|---|---|---|
| SOT8025-1 | 3D model for products with SOT8025-1 package | Design support | 2023-02-07 |
| SOT8025-1 | wafer level chip-scale package; 16 bumps; 1.455 mm x 1.455 mm x 0.43 mm bod | Package information | 2022-07-08 |
| SOT8025-1_336 | WLCSP16; Reel dry pack for SMD, 7"; Q1/T1 product orientation | Packing information | 2023-03-03 |
Products in this package
Analog & Logic ICs
| Type number | Description | Quick access |
|---|---|---|
| NXS0506UP | SD 3.0-compatible memory card integrated auto-direction control and level translator with EMI filter and ESD protection |