Package information
| Package information | Package name | Package description | Reference | Date |
|---|---|---|---|---|
| SOT8041-2 | HWQFN24 | HWQFN24: plastic thermal enhanced package; no leads; 24 terminals; 0.5 mm pitch, 4.00 × 4.00 × 0.75 mm body | 2024-12-16 |
Related documents
| File name | Title | Type | Date |
|---|---|---|---|
| SOT8041-2 | HWQFN24: plastic thermal enhanced package; no leads; 24 terminals;0.5 mm pitch, 4.00 × 4.00 × 0.75 mm body | Package information | 2025-01-29 |
| SOT8041-2_518 | HWQFN24; Reel dry pack for SMD, 13"; Q1/T1 product orientation | Packing information | 2025-01-27 |
Products in this package
Analog & Logic ICs
| Type number | Description | Quick access |
|---|---|---|
| NEX5204100BY | USB Type-C️ and Power Delivery controller |