Package information
| Package information | Package name | Package description | Reference | Date |
|---|---|---|---|---|
| SOT8062-1 | HTSSOP | Plastic, thermal enhanced thin shrink small outline package; 8 leads, 0.65 mm pitch, 3 mm × 3 mm × 1.1 mm body | MO-187 (AA) (JEDEC) | 2024-10-29 |
Related documents
| File name | Title | Type | Date |
|---|---|---|---|
| SOT8062-1 | Plastic, thermal enhanced thin shrink small outline package; 8 leads,0.65 mm pitch, 3 mm × 3 mm × 1.1 mm body | Package information | 2024-11-07 |
Products in this package
Analog & Logic ICs
| Type number | Description | Quick access |
|---|---|---|
| NEX90230APA-Q100 | 300mA, 40V ultra-low Iq (5.3 µA) low-dropout voltage regulator | |
| NEX90515BPA-Q100 | 150 mA, 40 V ultra-low Iq (5.3 µA) low-dropout voltage regulator | |
| NEX90515APA-Q100 | 150 mA, 40 V ultra-low Iq (5.3 µA) low-dropout voltage regulator | |
| NEX90230BPA-Q100 | 300mA, 40V ultra-low Iq (5.3 µA) low-dropout voltage regulator | |
| NEX90530BPA-Q100 | 300mA, 40V ultra-low Iq (5.3 µA) low-dropout voltage regulator | |
| NEX90530APA-Q100 | 300mA, 40V ultra-low Iq (5.3 µA) low-dropout voltage regulator |