Package information
| Package information | Package name | Package description | Reference | Date |
|---|---|---|---|---|
| WLCSP22_SOT8086 | WLCSP22 | wafer level chip-size package | MO-211 (JEDEC) | 2024-02-19 |
Related documents
| File name | Title | Type | Date |
|---|---|---|---|
| WLCSP22_SOT8086 | wafer level chip-size package | Package information | 2024-04-25 |
| WLCSP22_SOT8086_341 | WLCSP22; Reel dry pack for SMD, 7"; Q2/T3 product orientation | Packing information | 2024-03-28 |
Products in this package
GaN FETs
| Type number | Description | Quick access |
|---|---|---|
| GANB4R8-040CBA | 40 V, 4.8 mOhm bi-directional Gallium Nitride (GaN) FET in a 2.1 mm x 2.1 mm Wafer Level Chip-Scale Package (WLCSP) |