Package information
| Package information | Package name | Package description | Reference | Date |
|---|---|---|---|---|
| WLCSP22_SOT8089 | WLCSP22 | WLCSP22: wafer level chip-size package; 22 bumps (2 × 12) | 2025-01-08 |
Related documents
| File name | Title | Type | Date |
|---|---|---|---|
| WLCSP22_SOT8089 | WLCSP22: wafer level chip-size package; 22 bumps (2 × 12) | Package information | 2025-01-16 |
| WLCSP22_SOT8089_341 | WLCSP22; Reel dry pack for SMD, 7"; Q2/T3 product orientation | Packing information | 2024-03-28 |
Products in this package
GaN FETs
| Type number | Description | Quick access |
|---|---|---|
| GANE2R7-100CBA | 100 V, 2.7 mOhm Gallium Nitride (GaN) FET in a 4.45 mm x 2.30 mm Wafer Level Chip-Scale Package (WLCSP) |