Bipolar transistors

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ESD protection, TVS, filtering and signal conditioning

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SiC MOSFETs

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Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

74AVC1T1022DP

1-to-4 fan-out buffer

The 74AVC1T1022 is a translating 1-to-4 fan-out buffer suitable for use in clock distribution. It has dual supplies (VCC(A) and VCC(B)) for voltage translation. It also has a data input (A), four data outputs (1Yn and 2Yn) and an output enable input (OE). VCC(A) and VCC(B) can be independently supplied at any voltage between 0.8 V and 3.6 V. It makes the device suitable for low voltage translation between any of the following voltages: 0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V and 3.3 V. The levels of A, OE and 1Yn are referenced to VCC(A), outputs 2Yn are referenced to VCC(B). This supply configuration ensures that two of the fanned out signals can be used in level shifting. A HIGH on OE causes all outputs to be pulled LOW via pull-down resistors, a LOW on OE disconnects the pull-down resistors and enables all outputs.

Schmitt trigger action at all inputs makes the circuit tolerant for slower input rise and fall time.

The IOFF circuitry disables the output, preventing any damaging backflow current through the device when it is powered down.

Features and benefits

  • Wide supply voltage range:

    • VCC(A): 0.8 V to 3.6 V

    • VCC(B): 0.8 V to 3.6 V

  • Complies with JEDEC standards:

    • JESD8-12 (0.8 V to 1.3 V)

    • JESD8-11 (0.9 V to 1.65 V)

    • JESD8-7 (1.2 V to 1.95 V)

    • JESD8-5 (1.8 V to 2.7 V)

    • JESD8-B (2.7 V to 3.6 V)

  • Maximum data rates:

    • 380 Mbit/s (≥ 1.8 V to 3.3 V translation)

    • 200 Mbit/s (≥ 1.1 V to 3.3 V translation)

    • 200 Mbit/s (≥ 1.1 V to 2.5 V translation)

    • 200 Mbit/s (≥ 1.1 V to 1.8 V translation)

    • 150 Mbit/s (≥ 1.1 V to 1.5 V translation)

    • 100 Mbit/s (≥ 1.1 V to 1.2 V translation)

  • Latch-up performance exceeds 100 mA per JESD 78 Class II

  • Inputs accept voltages up to 3.6 V

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 3B exceeds 8000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

Parametrics

Type number VCC(A) (V) VCC(B) (V) Logic switching levels Output drive capability (mA) tpd (ns) Nr of bits Power dissipation considerations Tamb (°C) Rth(j-a) (K/W) Ψth(j-top) (K/W) Rth(j-c) (K/W) Package name Category
74AVC1T1022DP 0.8 - 3.6 0.8 - 3.6 CMOS/LVTTL ± 12 4.0 1 very low -40~125 186 22.5 94.6 TSSOP10 Uni-directional

PCB Symbol, Footprint and 3D Model

Model Name Description

Package

Type number Orderable part number, (Ordering code (12NC)) Status Marking Package Package information Reflow-/Wave soldering Packing
74AVC1T1022DP 74AVC1T1022DPJ
(935305831118)
Active B2 SOT552-1
TSSOP10
(SOT552-1)
SOT552-1 SSOP-TSSOP-VSO-WAVE
SOT552-1_118

Environmental information

Type number Orderable part number Chemical content RoHS RHF-indicator
74AVC1T1022DP 74AVC1T1022DPJ 74AVC1T1022DP rohs rhf rhf
Quality and reliability disclaimer

Documentation (12)

File name Title Type Date
74AVC1T1022 1-to-4 fan-out buffer Data sheet 2024-06-25
AN90007 Pin FMEA for AVC family Application note 2018-11-30
Nexperia_document_guide_Logic_translators Nexperia Logic Translators Brochure 2021-04-12
Nexperia_document_guide_MiniLogic_PicoGate_201901 PicoGate leaded logic portfolio guide Brochure 2019-01-07
SOT552-1 3D model for products with SOT552-1 package Design support 2020-01-22
avc1t1022 74AVC1T1022 IBIS model IBIS model 2015-10-26
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
TSSOP10_SOT552_mk plastic, thin shrink small outline package; 10 leads; 0.5 mm pitch; 3 mm x 3 mm x 1.1 mm body Marcom graphics 2017-01-28
SOT552-1 plastic, thin shrink small outline package; 10 leads; 0.5 mm pitch; 3 mm x 3 mm x 1.1 mm body Package information 2022-06-07
SOT552-1_118 TSSOP10; Reel pack for SMD, 13''; Q1/T1 product orientation Packing information 2020-04-21
74AVC1T1022DP_Nexperia_Product_Reliability 74AVC1T1022DP Nexperia Product Reliability Quality document 2024-06-16
SSOP-TSSOP-VSO-WAVE Footprint for wave soldering Wave soldering 2009-10-08

Support

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Models

File name Title Type Date
avc1t1022 74AVC1T1022 IBIS model IBIS model 2015-10-26
SOT552-1 3D model for products with SOT552-1 package Design support 2020-01-22

PCB Symbol, Footprint and 3D Model

Model Name Description

Ordering, pricing & availability

Type number Orderable part number Ordering code (12NC) Status Packing Packing Quantity Buy online
74AVC1T1022DP 74AVC1T1022DPJ 935305831118 Active SOT552-1_118 2,500 Order product

Sample

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If you do not have a direct account with Nexperia our network of global and regional distributors is available and equipped to support you with Nexperia samples. Check out the list of official distributors.

How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

Orderable parts

Type number Orderable part number Ordering code (12NC) Package Buy from distributors
74AVC1T1022DP 74AVC1T1022DPJ 935305831118 SOT552-1 Order product