74CBTLV3245
Parametrics
| Type number | VCC (V) | VPASS (V) | Logic switching levels | RON (Ω) | f(-3dB) (MHz) | Nr of bits | tpd (ns) | Power dissipation considerations | Tamb (°C) | Package name | |||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74CBTLV3245BQ | 2.3 - 3.6 | 3.3 | CMOS/LVTTL | 7 | 400 | 8 | 0.2 | very low | -40~125 | DHVQFN20 | |||
| 74CBTLV3245PW | 2.3 - 3.6 | 3.3 | CMOS/LVTTL | 7 | 400 | 8 | 0.2 | very low | -40~125 | 99 | 4.3 | 43.4 | TSSOP20 |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| 74CBTLV3245BQ | 74CBTLV3245BQ,115 (935293822115) |
Active | BTLV3245 |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| 74CBTLV3245PW | 74CBTLV3245PW,118 (935293823118) |
Active | TLV3245 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| 74CBTLV3245BQ | 74CBTLV3245BQ,115 | 74CBTLV3245BQ |
|
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| 74CBTLV3245PW | 74CBTLV3245PW,118 | 74CBTLV3245PW |
|
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Documentation (11)
| File name | Title | Type | Date |
|---|---|---|---|
| 74CBTLV3245 | 8-bit bus switch with output enable | Data sheet | 2024-06-24 |
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| cbtlv3245 | 74CBTLV3245 IBIS Model | IBIS model | 2013-11-11 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN20_SOT764-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
| SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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