74LVC1G16-Q100
Parametrics
Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|---|
74LVC1G16GW-Q100 | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 175 | 1 | low | -40~125 | TSSOP5 |
Package
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
74LVC1G16GW-Q100 | 74LVC1G16GW-Q100H (935691203125) |
Active | Yr |
TSSOP5 (SOT353-1) |
SOT353-1 |
WAVE_BG-BD-1
|
SOT353-1_125 |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
74LVC1G16GW-Q100 | 74LVC1G16GW-Q100H | 74LVC1G16GW-Q100 |
Documentation (8)
File name | Title | Type | Date |
---|---|---|---|
74LVC1G16_Q100 | Single buffer | Data sheet | 2023-08-15 |
Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
SOT353-1 | 3D model for products with SOT353-1 package | Design support | 2019-09-23 |
lvc1g16 | 74LVC1G16 IBIS model | IBIS model | 2015-10-30 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
TSSOP5_SOT353-1_mk | plastic, thin shrink small outline package; 5 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body | Marcom graphics | 2018-07-25 |
SOT353-1 | plastic thin shrink small outline package; 5 leads; body width 1.25 mm | Package information | 2022-11-15 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
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Ordering, pricing & availability
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